5SGSMD3H1F35I2WN

The 5SGSMD3H1F35I2WN is a Stratix® V GS Field Programmable Gate Array offering high logic density, abundant embedded memory, and a broad I/O complement in a 1152-ball FCBGA package. Designed for industrial temperature applications, the device targets complex digital designs that require substantial on-chip resources and robust thermal/voltage operating points.

This device is a member of the Stratix V GS family and is documented within the Stratix V device datasheet for electrical and switching characteristics, including detailed I/O timing and programmable I/O element behavior.

Key Features

• High Logic Density  Contains 236,000 logic elements to implement large or complex gateware and custom accelerators.
• Embedded Memory  Provides approximately 13.3 Mbits of on-chip RAM for buffering, state storage, and LUT-based memory structures.
• Extensive I/O  432 user I/O pins enable multi-channel interfacing and dense peripheral connectivity.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Core Voltage Operating Range  Core supply range specified from 870 mV to 930 mV to match system power-rail planning.
• Package and Mounting  1152-BBGA (FCBGA) supplier package: 1152-FBGA (35×35); surface-mount mounting for standard PCB assembly.
• Regulatory Compliance  RoHS compliant.
• Family-Level Documentation  Stratix V datasheet provides comprehensive electrical and switching specifications, including I/O timing and programmable I/O element delay.

Typical Applications

• High-density digital designs  Use the 236,000 logic elements and embedded memory to implement complex custom logic, datapaths, and hardware accelerators.
• Multi-channel I/O systems  432 I/O pins support systems that need many parallel interfaces or extensive sensor and peripheral connectivity.
• Industrial embedded systems  Industrial temperature rating (−40 °C to 100 °C) makes the device suitable for deployment in temperature-challenging environments.

Unique Advantages

• Large on-chip resources:  A combination of 236,000 logic elements and ~13.3 Mbits of embedded memory reduces dependence on external logic and RAM, simplifying board-level design.
• Significant I/O capacity:  432 user I/Os enable dense peripheral and subsystem integration without excessive multiplexing or external bridge logic.
• Industrial robustness:  Specified operating range from −40 °C to 100 °C and industrial grade classification for reliable operation in demanding environments.
• Compact, surface-mount packaging:  1152-ball FCBGA (35×35) package balances high pin count with a compact footprint for space-constrained PCBs.
• Controlled core supply window:  870–930 mV supply specification supports well-defined power delivery and thermal planning.
• Documented electrical characteristics:  Family datasheet coverage of electrical and switching characteristics and I/O timing supports accurate system integration and timing closure.

Why Choose 5SGSMD3H1F35I2WN?

The 5SGSMD3H1F35I2WN combines high logic capacity, substantial embedded RAM, and a wide I/O complement in an industrial-grade Stratix V GS device. Its defined core voltage window and documented electrical/switching characteristics aid predictable system design and power planning. The 1152-ball FCBGA package provides a compact solution for dense designs requiring surface-mount assembly.

This device is well suited to engineering teams building complex digital systems that need on-chip resources, robust thermal tolerance, and clear device-level specifications for timing and I/O behavior.

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