5SGSMD3H2F35C1G

The 5SGSMD3H2F35C1G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC in a 1152‑ball FCBGA package. It delivers high logic capacity, embedded memory, and a large I/O count suitable for complex programmable logic designs in commercial applications.

Built on the Stratix V family architecture, this device is intended for designs that require dense logic resources, substantial on‑chip RAM, and a compact surface‑mount package while operating within commercial temperature and low-voltage core ranges.

Key Features

• High Logic Density  236,000 logic elements (LEs) to implement large-scale programmable logic and complex state machines.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM for buffering, FIFOs, and embedded storage close to logic.
• I/O Capacity  432 user I/Os to support broad peripheral interfacing and high‑pin‑count system designs.
• Package  1152‑BBGA FCBGA (supplier package: 1152‑FBGA, 35×35) surface‑mount package for dense board integration.
• Low‑Voltage Core Supply  Core supply range 870 mV to 930 mV to meet specified device operating conditions.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial‑temperature system environments.
• Mounting and Compliance  Surface mount device; RoHS compliant to meet standard environmental requirements.

Typical Applications

• High‑density programmable logic  Implement complex digital functions and custom accelerators using the device's large pool of logic elements and embedded memory.
• Multi‑I/O interfacing  Systems requiring extensive external connectivity can leverage the 432 I/Os available on the device.
• Compact board designs  The 1152‑BBGA (35×35) FCBGA package supports high integration in space‑constrained PCB layouts.

Unique Advantages

• High logic and memory integration: 236,000 logic elements combined with ~13.3 Mbits of embedded RAM reduce the need for external logic and memory components.
• Large I/O count: 432 I/Os simplify system partitioning and avoid additional I/O expansion chips.
• Low core voltage operation: Core supply between 870 mV and 930 mV supports designs targeting low‑voltage FPGA operation as specified.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with commercial product requirements.
• RoHS compliant: Meets standard environmental regulations for lead‑free assembly and shipment.
• Space‑efficient packaging: 1152‑ball FCBGA (35×35) enables high‑density PCB implementations.

Why Choose 5SGSMD3H2F35C1G?

The 5SGSMD3H2F35C1G provides a balanced combination of high logic capacity, embedded memory, and extensive I/O in a compact FCBGA package for commercial designs. Its specifications make it suitable for projects that require dense programmable logic, significant on‑chip RAM, and many external interfaces while operating at commercial temperature ranges and low core voltages.

Designers and procurement teams seeking a Stratix V GS‑family FPGA with clearly defined electrical and thermal operating parameters will find this device appropriate for scalable, board‑level integration where RoHS compliance and surface‑mount assembly are required.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the 5SGSMD3H2F35C1G.