5SGSMD3H2F35C2G

The 5SGSMD3H2F35C2G is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 1152‑BBGA FCBGA package. It provides high logic capacity, substantial on‑chip memory, and a large I/O complement for demanding programmable-logic designs.

With 236,000 logic elements, approximately 13.312 Mbits of embedded memory, and 432 user I/Os, this commercial‑grade device targets designs that require dense logic integration, extensive interfacing, and low core-voltage operation.

Key Features

• Core Capacity  236,000 logic elements for implementing complex digital logic and compute-intensive functions.
• Embedded Memory  Approximately 13.312 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-hungry algorithms.
• I/O Resources  432 user I/Os to support wide external interfaces and high pin-count connectivity.
• Power Supply  Core voltage range of 870 mV to 930 mV for compatibility with low-voltage power domains and power-optimized system designs.
• Package & Mounting  1152‑BBGA (FCBGA), supplier package 1152‑FBGA (35×35), surface-mount for compact board-level integration.
• Operating Grade & Temperature  Commercial grade, specified for operation from 0 °C to 85 °C.
• Regulatory Compliance  RoHS‑compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital signal processing  Implement DSP pipelines and parallel processing functions using the device's large logic fabric and embedded memory.
• Large I/O systems and protocol bridging  Support designs that require many external interfaces or protocol translation with 432 available I/Os.
• Custom accelerator and compute modules  Deploy on-board accelerators that leverage the high logic element count and on-chip RAM for low-latency processing.

Unique Advantages

• High integration density: 236,000 logic elements and substantial embedded memory reduce the need for external logic and memory components.
• Extensive I/O capability: 432 I/Os enable broad connectivity options without additional I/O expanders.
• Compact, board-ready package: 1152‑BBGA FCBGA (35×35) supports high-pin-count designs in a compact surface-mount form factor.
• Low-voltage core support: 870–930 mV supply range facilitates integration with modern low-voltage power architectures.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliance: Environmentally compatible manufacturing and assembly.

Why Choose 5SGSMD3H2F35C2G?

The 5SGSMD3H2F35C2G combines high logic capacity, substantial embedded memory, and a large I/O count in a compact 1152‑BBGA package, making it well suited to complex, board‑level FPGA designs that require dense integration and extensive interfacing. As a commercial‑grade Stratix® V GS device from Intel, it delivers the platform-level resources necessary for advanced digital processing and custom accelerator implementations.

Engineers designing systems that prioritize on‑chip memory, high logic density, and many external connections will find this device a practical choice for scalable, performance-oriented FPGA implementations.

Request a quote or submit an inquiry to our sales team to discuss pricing, availability, and support for integrating the 5SGSMD3H2F35C2G into your next design.