5SGSMD3H2F35C2LG

The 5SGSMD3H2F35C2LG is a Stratix V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in a commercial temperature grade. It delivers high on‑chip logic capacity, substantial embedded memory, and a broad I/O count suitable for dense digital designs and system integration.

Designed for applications that require a large number of programmable logic elements, significant on‑chip RAM, and flexible I/O, this device combines high integration in a 1152‑BBGA (35×35) FCBGA package with a defined supply and operating range for predictable deployment in commercial environments.

Key Features

• Logic Capacity  Provides 236,000 logic elements for implementing complex digital functions and custom hardware logic.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM to support buffering, tables, and memory‑intensive logic blocks.
• I/O Resources  432 user I/O pins to support extensive board‑level interfacing and peripheral connectivity.
• Package  1152‑BBGA, FCBGA footprint (supplier package listed as 1152‑FBGA 35×35) for a high‑density board implementation.
• Voltage Supply  Specified supply range of 820 mV to 880 mV to match system power design and sequencing requirements.
• Thermal/Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial deployments.
• Mounting & Compliance  Surface mount device, RoHS compliant for lead‑free production processes.

Typical Applications

• High‑density digital processing  Implement complex state machines, datapaths, and custom accelerators using the large pool of logic elements.
• Memory‑centric designs  On‑chip RAM (≈13.3 Mbits) supports buffering, FIFOs, and lookup structures without relying solely on external memory.
• I/O‑intensive systems  Large I/O count enables integration with multiple peripherals, sensors, or board subsystems requiring many signals.
• Prototyping and system integration  Use as a platform for validating system architectures where high logic capacity and plentiful I/O are required.

Unique Advantages

• High logic density: 236,000 logic elements allow consolidation of complex functions into a single device, reducing overall system component count.
• Substantial on‑chip RAM: Approximately 13.3 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O capability: 432 I/Os simplify board routing and enable direct interfacing to a wide range of external devices and peripherals.
• Compact, high‑density package: 1152‑BBGA (35×35) packaging delivers a dense footprint for space‑constrained PCBs while maintaining high pin count.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match standard commercial product environments.
• RoHS compliant: Supports lead‑free manufacturing and regulatory requirements for commercial electronics.

Why Choose 5SGSMD3H2F35C2LG?

This Stratix V GS FPGA balances large programmable logic capacity, significant embedded memory, and a high I/O count in a single commercial‑grade FCBGA package. It is suited for designers who need to integrate dense digital logic, on‑chip storage, and extensive external interfacing without partitioning the design across multiple devices.

With defined supply and temperature specifications and RoHS compliance, the 5SGSMD3H2F35C2LG is positioned for procurement into commercial embedded systems where predictability, integration, and board‑level density are priorities.

Request a quote or submit a procurement inquiry for 5SGSMD3H2F35C2LG to receive pricing and availability details for your project requirements.