5SGSMD3H2F35C3G

The 5SGSMD3H2F35C3G is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1152‑BBGA FCBGA package. It delivers high logic density and abundant I/O for designs that require extensive on‑chip programmable logic and embedded memory.

With 236,000 logic elements and approximately 13.3 Mbits of embedded RAM, this commercial‑grade device is suited to applications that need large programmable fabric, significant local memory, and a compact BGA footprint.

Key Features

• Core Logic  236,000 logic elements provide high-density programmable logic resources for complex designs.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM to support data buffering, packet processing, and local storage.
• I/O Count  432 general-purpose I/O pins to support wide bus widths, multiple interfaces, and extensive external connectivity.
• Power Supply  Core supply range of 820 mV to 880 mV for device operation planning and power budgeting.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package 1152‑FBGA, 35×35) designed for surface-mount PCB assembly.
• Operating Grade  Commercial temperature grade with operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑density programmable logic  Implement large-scale custom logic functions and state machines using the device's extensive logic resources.
• Memory‑intensive processing  Utilize the embedded RAM for buffering, data staging, and local algorithmic storage.
• Multi‑interface aggregation  Leverage 432 I/O pins to connect multiple peripherals, parallel buses, or front-end interfaces.
• Compact system integration  Deploy in space‑constrained PCBs where a high‑pin‑count BGA package enables dense routing and integration.

Unique Advantages

• High logic density: 236,000 logic elements provide capacity for complex implementations without external glue logic.
• Substantial on‑chip memory: Approximately 13.3 Mbits of embedded RAM reduces dependence on external memory for many designs.
• Generous I/O resources: 432 I/O pins simplify interfacing to multiple peripherals and parallel data paths.
• Compact BGA footprint: 1152‑BBGA (35×35) package enables high pin count in a compact form factor for dense PCBs.
• Commercial temperature support: Rated for 0 °C to 85 °C, suitable for a wide range of controlled‑environment applications.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGSMD3H2F35C3G?

The 5SGSMD3H2F35C3G provides a balanced combination of large programmable logic capacity, significant embedded memory, and extensive I/O in a compact 1152‑BBGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream electronic systems that require dense logic integration and robust on‑chip resources.

Designers targeting complex FPGA implementations, memory‑heavy processing tasks, or multi‑interface systems will find the device's specification set advantageous for reducing external components and simplifying board-level design while leveraging Stratix® V GS architecture capabilities.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the 5SGSMD3H2F35C3G.