5SGSMD3H2F35C2LN

The 5SGSMD3H2F35C2LN is an Intel Stratix V GS field-programmable gate array supplied in a 1152-BBGA FCBGA package. It pairs a high logic density with abundant embedded memory and GS-class transceiver and DSP-oriented architecture to address bandwidth- and DSP-centric designs.

Designed for commercial-grade applications, this device is optimized for transceiver-based digital signal processing, high-throughput interfaces, and data-intensive system functions where large logic capacity, on-chip RAM, and many I/Os are required.

Key Features

• Core architecture  Stratix V family architecture with enhanced adaptive logic modules and a multi-track routing fabric as described in the device family overview.
• Logic capacity  236000 logic elements for implementing complex custom logic and system functions.
• Embedded memory  Approximately 13.312 Mbits of on-chip RAM (13,312,000 total RAM bits) to support buffering, LUTs, and memory-intensive algorithms.
• DSP and transceiver orientation  GS-class Stratix V devices are targeted for DSP-centric applications and include variable precision DSP resources and integrated transceivers capable of supporting high-speed links (GS devices support 14.1-Gbps transceivers in the family).
• I/O density  432 user I/Os to interface with high-pin-count systems and multi-channel data paths.
• Power and supply  Core voltage range specified at 820 mV to 880 mV for device operation.
• Package  1152-BBGA FCBGA (supplier package: 1152-FBGA, 35×35) surface-mount package to support compact, high-density board designs.
• Operating range and grade  Commercial temperature grade with operating temperature from 0°C to 85°C; RoHS-compliant.

Typical Applications

• High‑performance DSP systems  Implement multi-channel signal processing, filtering, and precision arithmetic using the device’s DSP-oriented architecture and embedded memory.
• Optical and backplane interfaces  Use the GS-class transceiver capabilities and high I/O count to support 40G/100G-class interfaces and backplane connectivity.
• Packet processing and network equipment  Large logic capacity and on-chip RAM enable packet classification, buffering, and traffic management functions.
• Broadcast and high-performance computing  Accelerate compute- and data-intensive algorithms that benefit from abundant logic, memory, and DSP resources.

Unique Advantages

• Large programmable capacity: 236000 logic elements provide the headroom needed for complex system integration on a single device.
• Significant on-chip memory: Approximately 13.312 Mbits of embedded RAM reduce external memory dependence and streamline data paths.
• High I/O count: 432 I/Os allow extensive external interfacing and multi-channel connectivity without board-level multiplexing.
• DSP- and transceiver-focused design: The GS variant is optimized for transceiver-based DSP applications, aligning architecture and hard IP for those workloads.
• Compact FCBGA packaging: 1152-BBGA (35×35) package supports dense board layouts while providing the required pin count for high-throughput systems.
• Commercial-grade reliability: Specified operating range of 0°C to 85°C and RoHS compliance suitable for commercial production environments.

Why Choose 5SGSMD3H2F35C2LN?

The 5SGSMD3H2F35C2LN brings Stratix V GS family capabilities into a single, high-density FPGA package—combining substantial logic resources, multi-megabit embedded memory, and GS-class transceiver and DSP orientation. It is well suited for designers building DSP-heavy, bandwidth-focused systems that require many I/Os and compact board integration.

For teams targeting scalable, performance-driven designs in data‑intensive networking, broadcast, and compute applications, this device provides a balance of logic density, embedded memory, and interface capability backed by the Stratix V device family architecture.

If you would like pricing, availability, or to request a quote for 5SGSMD3H2F35C2LN, please submit a quote request or contact sales through the appropriate procurement channel.