5SGSMD3H2F35C3N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 1,244 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H2F35C3N – Stratix V GS FPGA, 432 I/O, 236,000 logic elements

The 5SGSMD3H2F35C3N is a Stratix® V GS field-programmable gate array (FPGA) from Intel, built on a 28‑nm process and targeted at transceiver‑based, DSP‑centric applications. This commercial‑grade device combines high logic density, substantial on‑chip memory, and a large I/O count to address bandwidth‑heavy designs and complex signal processing tasks.

With 236,000 logic elements, approximately 13.3 Mbits of embedded memory, and 432 I/O, the device is suited for applications that require deep processing resources, extensive interfacing, and integrated high‑speed serial connectivity options offered within the Stratix V family.

Key Features

  • Core and Process  28‑nm TSMC process technology used across the Stratix V family; device operates with a core supply range of 820 mV to 880 mV.
  • Logic Capacity  236,000 logic elements to implement complex FPGA designs and large-scale custom logic.
  • Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM provided by M20K memory blocks common to the Stratix V architecture.
  • DSP Resources  Stratix V GS family devices include variable‑precision DSP blocks (family capability includes support for up to 3,926 18×18 or 1,963 27×27 multipliers), enabling high‑performance arithmetic and signal processing implementations.
  • High‑speed Transceivers  GS devices in the Stratix V family offer integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interfaces.
  • I/O and Packaging  432 I/O pins in a surface‑mount 1152‑BBGA (FCBGA) package / supplier package 1152‑FBGA (35×35) for dense board integration and routing.
  • Clocking and System Integration  Family architecture includes fractional PLLs, multi‑track routing, and a comprehensive fabric clocking network to support complex timing domains.
  • Grade and Environmental  Commercial‑grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

  • High‑performance DSP systems  Use the abundant variable‑precision DSP blocks and large logic capacity for signal processing pipelines, filters, and real‑time computation tasks.
  • Optical and Backplane Interfaces  Integrated 14.1‑Gbps transceivers make the device suitable for backplane and optical interface applications requiring high serial bandwidth.
  • Network and Packet Processing  Large on‑chip memory and extensive logic enable packet processing, traffic management, and other data‑intensive networking functions.
  • Broadcast and Military Communications  Architected to support transceiver‑based, DSP‑centric applications common in broadcast and military communications equipment.

Unique Advantages

  • High logic density: 236,000 logic elements allow implementation of large, feature‑rich FPGA designs without immediate partitioning.
  • Significant embedded memory: Approximately 13.3 Mbits of on‑chip RAM reduce external memory requirements and simplify board-level design.
  • Integrated high‑speed connectivity: GS family transceivers providing up to 14.1 Gbps ease integration of high‑bandwidth interfaces.
  • Comprehensive DSP support: Variable‑precision DSP blocks enable efficient implementation of complex arithmetic operations and signal processing algorithms.
  • Dense I/O and package: 432 I/O in a 1152‑BBGA (35×35) FCBGA package supports compact, high‑pin‑count board designs.
  • Commercial readiness: RoHS compliance and a 0 °C–85 °C operating range match standard commercial product deployment environments.

Why Choose 5SGSMD3H2F35C3N?

The 5SGSMD3H2F35C3N balances large logic capacity, plentiful embedded memory, and integrated high‑speed transceivers within the Stratix V GS family architecture. It is positioned for engineers building DSP‑intensive, bandwidth‑centric systems that require a combination of processing density, on‑chip RAM, and plentiful I/O in a compact surface‑mount package.

This device is well suited to teams developing data‑intensive networking, broadcast, and high‑performance computing applications who need scalable FPGA resources backed by the Stratix V feature set, including advanced clocking, DSP blocks, and integrated transceiver capability.

Request a quote or submit an inquiry to evaluate 5SGSMD3H2F35C3N for your next FPGA design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up