5SGSMD3H2F35I2G

The 5SGSMD3H2F35I2G is a Stratix V GS series FPGA in a 1152‑FBGA (35×35) package, offering high logic density and extensive I/O for demanding embedded and industrial designs. With large on‑chip memory and broad I/O capability, it targets applications that require complex logic implementation, high channel counts, and robust operating ranges.

Key Features

• Logic Capacity – 236,000 logic elements to implement complex algorithms and large hardware accelerators.
• Embedded Memory – Approximately 13.3 Mbits of on‑chip RAM for buffering, packet storage, and local data processing.
• I/O Resources – 432 user I/Os to support wide parallel interfaces, sensor arrays, or multi‑lane connectivity.
• Package & Mounting – 1152‑BBGA / FCBGA package (supplier device package: 1152‑FBGA, 35×35) in a surface‑mount form factor for dense board integration.
• Power Supply – Core voltage supply range of 870 mV to 930 mV for defined core power domain requirements.
• Temperature Grade – Industrial grade rated for operation from –40 °C to 100 °C to meet extended environmental conditions.
• Compliance – RoHS compliant.

Typical Applications

• Industrial Control and Automation – Use the device’s logic density and industrial temperature rating for complex control algorithms, motion control, and protocol bridging.
• High‑Density Data Processing – Implement packet buffering, custom data paths, and hardware accelerators using the large logic element count and on‑chip RAM.
• Multi‑Interface Gateways – Leverage 432 I/Os to connect multiple sensors, peripherals, or parallel interfaces in compact systems.
• Test & Measurement Equipment – Deploy flexible, high‑I/O FPGA logic for signal aggregation, preprocessing, and custom measurement pipelines.

Unique Advantages

• High logic density: 236,000 logic elements enable integration of complex finite state machines, custom processors, and signal processing blocks on a single device.
• Substantial embedded memory: Approximately 13.3 Mbits of RAM provides local storage for buffering, look‑up tables, and streaming data handling without external memory.
• Extensive I/O capability: 432 I/Os support broad interfacing options, reducing the need for external multiplexing or additional interface chips.
• Industrial temperature range: Rated for −40 °C to 100 °C operation, suitable for deployment in harsh or temperature‑varied environments.
• Compact, high‑density package: 1152‑FBGA (35×35) packaging enables high I/O and dense routing in space‑constrained PCBs.
• Defined core power domain: 870 mV–930 mV supply range provides clear requirements for power‑rail design and validation.

Why Choose 5SGSMD3H2F35I2G?

The 5SGSMD3H2F35I2G combines a high count of logic elements, substantial on‑chip memory, and a large I/O complement in a compact FCBGA package—making it well suited for industrial and high‑density embedded applications that demand on‑device processing and flexible interfacing. Its industrial temperature rating and RoHS compliance provide a reliable foundation for long‑life deployments.

This FPGA is appropriate for engineers designing systems that require a balance of logic capacity, memory, and I/O without sacrificing board area, with clearly defined electrical and thermal operating ranges to guide system integration.

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