5SGSMD3H2F35I2N

The 5SGSMD3H2F35I2N is an Intel Stratix V GS Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package. Built on the Stratix V architecture, this device targets transceiver-driven, DSP-centric and high-bandwidth applications by combining a high logic capacity with substantial embedded memory and a large I/O count.

Key value comes from its integration of variable-precision DSP resources and transceiver-capable architecture together with a robust industrial operating range, enabling deployment in demanding communications, broadcast, and compute environments.

Key Features

• Logic Capacity — 236,000 logic elements providing significant programmable fabric for complex designs.
• Adaptive Logic Modules — 89,000 adaptive logic modules (ALMs) as part of the device’s core building blocks.
• Embedded Memory — Approximately 13.312 Mbits of on-chip RAM (total RAM bits: 13,312,000) for buffering, packet processing, and DSP data storage.
• DSP and Transceiver Capability — Stratix V GS family devices include a large array of variable-precision DSP blocks and integrated transceivers with up to 14.1-Gbps data-rate capability, optimizing the part for transceiver-based DSP workloads.
• I/O and Packaging — 432 user I/Os in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package for dense board-level integration.
• Power and Voltage — Core supply operating range of 870 mV to 930 mV to match system power delivery requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial deployments.
• Standards & Compliance — RoHS compliant.

Typical Applications

• High-performance DSP systems — Leverages abundant variable-precision DSP blocks and large on-chip RAM for demanding signal processing and compute tasks.
• Optical and wireline communications — Integrated transceiver capability and high I/O density enable implementation of backplane and optical interface functions.
• Packet processing and network equipment — Large logic and memory resources support complex packet-processing pipelines and bandwidth-centric protocols.
• Broadcast and military communications — The combination of transceiver support, DSP resources, and industrial temperature range fits broadcast and defense communication system requirements.

Unique Advantages

• High programmable capacity: 236,000 logic elements provide room for complex logic, control, and data-path implementation without immediate migration to larger devices.
• DSP-centric architecture: Variable-precision DSP blocks and substantial embedded RAM streamline high-throughput signal processing designs.
• Transceiver-enabled I/O: Integrated transceiver capability tailored for high-speed serial links common in optical and backplane applications.
• Industrial readiness: Specified operation over −40 °C to 100 °C and surface-mount packaging support deployment in industrial environments.
• Compact, high-density package: 1152-BBGA (35×35) package with 432 I/Os delivers high connectivity in a compact footprint.
• RoHS compliant: Meets RoHS requirements for environmentally conscious applications and manufacturing.

Why Choose 5SGSMD3H2F35I2N?

The 5SGSMD3H2F35I2N combines the Stratix V GS family’s DSP-rich fabric, significant on-chip memory, and high I/O density to address bandwidth- and DSP-intensive designs. Its industrial temperature rating and RoHS compliance make it suitable for production deployments where reliability and regulatory conformance are required.

Designed as part of the Stratix V family, this device supports design scalability and production continuity within the Stratix V ecosystem, including options for migrating to HardCopy V ASICs when applicable.

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