5SGSMD3H2F35I3L
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 503 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 89000 | Number of Logic Elements/Cells | 236000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13312000 |
Overview of 5SGSMD3H2F35I3L – Stratix® V GS FPGA, 432 I/Os, ~13.3 Mbit RAM, 236k logic elements, 1152-BBGA
The 5SGSMD3H2F35I3L is a Stratix® V GS Field Programmable Gate Array (FPGA) IC offering a high-density logic fabric and abundant on-chip memory in a 1152-ball BGA package. Designed for industrial-grade applications, the device combines 236,000 logic elements with approximately 13.3 Mbits of embedded RAM and 432 user I/Os to support complex digital designs requiring large logic capacity and significant local memory.
Key platform characteristics include a surface-mount 1152-BBGA (35×35) package, an industrial operating temperature range of –40 °C to 100 °C, and a core voltage supply range of 820 mV to 880 mV. The device is RoHS compliant.
Key Features
- Core Logic Density 236,000 logic elements provide substantial programmable logic capacity for large-scale digital processing, state machines, and custom hardware acceleration.
- Embedded Memory Approximately 13.3 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without immediate reliance on external memory.
- High I/O Count 432 user I/Os enable wide data buses, multiple peripheral interfaces, and extensive board-level routing options.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C, suitable for industrial environments requiring extended temperature operation.
- Power and Voltage Core supply specified from 820 mV to 880 mV, allowing designers to plan power delivery and thermal management around defined operating voltages.
- Package and Mounting Supplier device package: 1152-FBGA (35×35) / Package case: 1152-BBGA, FCBGA, with surface-mount mounting for compact PCB integration.
- Compliance RoHS compliant to support environmental and regulatory requirements for lead-free assembly.
Typical Applications
- Industrial Control and Automation Industrial temperature rating and robust I/O count make this FPGA suitable for control systems and automation equipment that require reliable operation across wide temperature ranges.
- High-Density I/O Systems With 432 user I/Os, the device supports designs that need multiple parallel interfaces, wide data buses, or many sensor and actuator connections.
- Memory-Intensive Data Processing Approximately 13.3 Mbits of embedded memory enables local buffering, packet handling, and intermediate data storage for streaming and processing tasks.
Unique Advantages
- Large Programmable Fabric: 236,000 logic elements give designers headroom for complex algorithms, custom accelerators, and high-throughput datapath implementations.
- Substantial On-Chip Memory: Roughly 13.3 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs, simplifying board designs.
- High I/O Density: 432 user I/Os allow flexible interfacing to multiple peripherals, enabling consolidation of functionality on a single device.
- Designed for Industrial Environments: –40 °C to 100 °C operating range and a surface-mount BGA package support deployment in industrial-grade systems.
- Low-Voltage Core Operation: The specified 820 mV–880 mV core voltage range helps designers plan power delivery and optimize thermal performance for system-level power management.
- RoHS Compliant: Meets lead-free assembly requirements for most commercial and industrial products.
Why Choose 5SGSMD3H2F35I3L?
The 5SGSMD3H2F35I3L delivers a balanced combination of high logic density, generous on-chip memory, and extensive I/O resources within a compact 1152-BBGA package rated for industrial temperatures. It is positioned for designs that require significant programmable resources and local memory while maintaining a defined low-voltage core and surface-mount form factor.
This part is appropriate for engineers building robust industrial systems, high-density interface modules, or memory-dependent data-processing logic. Its spec sheet and family documentation describe Stratix V device characteristics and operating conditions to support detailed power, timing, and thermal planning.
Request a quote or submit a product inquiry to check availability, pricing, and lead time for the 5SGSMD3H2F35I3L. Technical documentation is available for review to assist integration and system design.

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