5SGSMD3H2F35I3L

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 503 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H2F35I3L – Stratix® V GS FPGA, 432 I/Os, ~13.3 Mbit RAM, 236k logic elements, 1152-BBGA

The 5SGSMD3H2F35I3L is a Stratix® V GS Field Programmable Gate Array (FPGA) IC offering a high-density logic fabric and abundant on-chip memory in a 1152-ball BGA package. Designed for industrial-grade applications, the device combines 236,000 logic elements with approximately 13.3 Mbits of embedded RAM and 432 user I/Os to support complex digital designs requiring large logic capacity and significant local memory.

Key platform characteristics include a surface-mount 1152-BBGA (35×35) package, an industrial operating temperature range of –40 °C to 100 °C, and a core voltage supply range of 820 mV to 880 mV. The device is RoHS compliant.

Key Features

  • Core Logic Density  236,000 logic elements provide substantial programmable logic capacity for large-scale digital processing, state machines, and custom hardware acceleration.
  • Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without immediate reliance on external memory.
  • High I/O Count  432 user I/Os enable wide data buses, multiple peripheral interfaces, and extensive board-level routing options.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial environments requiring extended temperature operation.
  • Power and Voltage  Core supply specified from 820 mV to 880 mV, allowing designers to plan power delivery and thermal management around defined operating voltages.
  • Package and Mounting  Supplier device package: 1152-FBGA (35×35) / Package case: 1152-BBGA, FCBGA, with surface-mount mounting for compact PCB integration.
  • Compliance  RoHS compliant to support environmental and regulatory requirements for lead-free assembly.

Typical Applications

  • Industrial Control and Automation  Industrial temperature rating and robust I/O count make this FPGA suitable for control systems and automation equipment that require reliable operation across wide temperature ranges.
  • High-Density I/O Systems  With 432 user I/Os, the device supports designs that need multiple parallel interfaces, wide data buses, or many sensor and actuator connections.
  • Memory-Intensive Data Processing  Approximately 13.3 Mbits of embedded memory enables local buffering, packet handling, and intermediate data storage for streaming and processing tasks.

Unique Advantages

  • Large Programmable Fabric:  236,000 logic elements give designers headroom for complex algorithms, custom accelerators, and high-throughput datapath implementations.
  • Substantial On-Chip Memory:  Roughly 13.3 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs, simplifying board designs.
  • High I/O Density:  432 user I/Os allow flexible interfacing to multiple peripherals, enabling consolidation of functionality on a single device.
  • Designed for Industrial Environments:  –40 °C to 100 °C operating range and a surface-mount BGA package support deployment in industrial-grade systems.
  • Low-Voltage Core Operation:  The specified 820 mV–880 mV core voltage range helps designers plan power delivery and optimize thermal performance for system-level power management.
  • RoHS Compliant:  Meets lead-free assembly requirements for most commercial and industrial products.

Why Choose 5SGSMD3H2F35I3L?

The 5SGSMD3H2F35I3L delivers a balanced combination of high logic density, generous on-chip memory, and extensive I/O resources within a compact 1152-BBGA package rated for industrial temperatures. It is positioned for designs that require significant programmable resources and local memory while maintaining a defined low-voltage core and surface-mount form factor.

This part is appropriate for engineers building robust industrial systems, high-density interface modules, or memory-dependent data-processing logic. Its spec sheet and family documentation describe Stratix V device characteristics and operating conditions to support detailed power, timing, and thermal planning.

Request a quote or submit a product inquiry to check availability, pricing, and lead time for the 5SGSMD3H2F35I3L. Technical documentation is available for review to assist integration and system design.

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