5SGSMD3H2F35I2WN

The 5SGSMD3H2F35I2WN is a Stratix® V GS field-programmable gate array (FPGA) offered in a 1152-BBGA FCBGA package. It delivers a high-density programmable fabric with extensive on-chip memory and a large I/O complement, targeting industrial-grade embedded designs requiring significant logic integration and I/O capacity.

Key attributes include 236,000 logic elements, approximately 13.3 Mbits of embedded memory, 432 user I/Os, and an industrial operating range. The device is RoHS compliant and provided in a surface-mount 1152-FBGA (35×35) package.

Key Features

• Core Logic  236,000 logic elements to support complex, high-density programmable logic implementations.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM for large buffering, state storage, and memory-intensive algorithms.
• I/O Capacity  432 user I/Os to interface with multiple peripherals, parallel buses, and high-pin-count subsystems.
• Power Supply  Core voltage range of 870 mV to 930 mV for defined power budgeting and supply design.
• Package & Mounting  1152-BBGA (FCBGA) supplier package: 1152-FBGA (35×35); surface-mount for standard PCB assembly flows.
• Temperature & Grade  Industrial grade with an operating temperature range of –40°C to 100°C for demanding environment deployments.
• Environmental Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• High-density programmable logic systems  Designs that require substantial logic resources and on-chip memory for custom signal processing or control functions.
• Multi-interface embedded platforms  Systems that need a large number of I/Os to connect to sensors, memory, and external peripherals.
• Industrial equipment and controllers  Industrial applications that require an extended operating temperature range and robust, surface-mount packaging.

Unique Advantages

• Large logic capacity: 236,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Significant embedded memory: Approximately 13.3 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage tasks.
• High I/O count: 432 I/Os provide flexibility for parallel interfaces, dense bus connectivity, and extensive peripheral integration.
• Industrial temperature rating: Rated from –40°C to 100°C for reliable operation across a wide range of deployment conditions.
• Compact, assembly-friendly package: 1152-FBGA (35×35) surface-mount package supports industry-standard PCB assembly processes.
• Regulatory-friendly: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose 5SGSMD3H2F35I2WN?

The 5SGSMD3H2F35I2WN Stratix V GS FPGA is positioned for engineers who need a high-density, industrial-grade FPGA with extensive embedded memory and a large number of I/Os in a compact BGA package. Its combination of 236,000 logic elements, roughly 13.3 Mbits of RAM, and 432 I/Os makes it suitable for consolidating complex functions and reducing external component count in demanding embedded systems.

This device delivers a verifiable set of specifications—power envelope, thermal range, package format, and compliance—that simplify system-level planning for industrial applications where integration, I/O bandwidth, and on-chip memory are key selection criteria.

If you would like pricing, availability, or to request a formal quote for 5SGSMD3H2F35I2WN, submit an inquiry to start the procurement process.