5SGSMD3H2F35I3G

The 5SGSMD3H2F35I3G is an Intel Stratix V GS FPGA IC designed for high-density programmable logic implementations. It combines a large logic fabric, significant on-chip memory, and a high I/O count in a 1152-BBGA FCBGA surface-mount package for industrial applications.

This device is specified for industrial temperature operation and a defined core supply voltage window, providing clear electrical and thermal parameters for system integration.

Key Features

• Core Capacity 236,000 logic elements to implement complex digital architectures on a single device.
• Embedded Memory Approximately 13.3 Mbits of on-chip RAM (13,312,000 bits) for buffering, FIFOs, and local data storage.
• I/O 432 user I/Os enabling broad peripheral and bus interfacing without immediate external expansion.
• Power Core voltage supply range of 0.820 V to 0.880 V, providing a defined operating window for power-domain planning.
• Package & Mounting 1152-BBGA, FCBGA (supplier package 1152-FBGA, 35×35) in a surface-mount form factor for high-pin-count PCB designs.
• Temperature Grade Industrial operating temperature range from −40°C to 100°C for deployment in demanding environments.
• Compliance RoHS-compliant.

Typical Applications

• High-density logic designs Systems that require approximately 236,000 logic elements to implement large-scale programmable logic and custom accelerators.
• Memory-intensive processing Designs that need approximately 13.3 Mbits of embedded memory for on-chip buffering and state retention.
• High I/O integration Applications requiring up to 432 I/Os to connect multiple peripherals, sensors, or parallel data lanes.
• Industrial and field equipment Deployments that require operation across −40°C to 100°C where industrial temperature support is required.

Unique Advantages

• High logic density: 236,000 logic elements enable consolidation of complex functions onto a single FPGA, reducing external logic.
• Substantial on-chip RAM: Approximately 13.3 Mbits of embedded memory reduces dependency on external memory for many designs.
• Extensive I/O capability: 432 I/Os provide flexibility to integrate numerous interfaces and parallel data paths directly to the FPGA.
• Industrial temperature rating: Specified −40°C to 100°C operation supports reliable use in harsh or variable environments.
• High-pin-count FCBGA package: 1152-BBGA (35×35) supports dense routing and high integration on compact PCBs.
• Defined core supply window: 0.820–0.880 V core supply simplifies power supply design and verification.

Why Choose 5SGSMD3H2F35I3G?

As part of the Intel Stratix V family, the 5SGSMD3H2F35I3G offers a combination of large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade FPGA. These attributes make it suitable for engineers who need to implement complex, resource-intensive designs while meeting defined electrical and thermal constraints.

The device's packaging and supply/temperature specifications support straightforward integration into high-density boards and industrial systems where predictable operating windows and RoHS compliance are required.

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