5SGSMD3H2F35I2LN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 956 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H2F35I2LN – Stratix® V GS FPGA, 236,000 logic elements, 432 I/O, 1152-BBGA

The 5SGSMD3H2F35I2LN is an Intel Stratix V GS field-programmable gate array (FPGA) built on the Stratix V family architecture. It combines a high logic density of 236,000 logic elements with abundant embedded memory and DSP resources for transceiver-based, DSP-centric applications.

Targeted at data- and signal-processing markets, this industrial-grade device supports high-throughput DSP implementations and transceiver interfaces while providing a compact surface-mount FCBGA package and an extended operating temperature range for deployment in demanding environments.

Key Features

  • Core architecture — Stratix V family device built on 28‑nm process technology with a redesigned adaptive logic module (ALM) and a multi-track routing fabric.
  • Logic capacity — 236,000 logic elements suitable for complex FPGA designs and large-scale logic implementations.
  • Embedded memory — Approximately 13.3 Mbits of on-chip RAM (13,312,000 bits) for buffering, packet processing, and intermediate data storage.
  • DSP resources — GS variant supports an abundance of variable-precision DSP blocks, including support for up to 3,926 18×18 or 1,963 27×27 multipliers for high-performance signal processing.
  • Transceiver capability — GS devices in the Stratix V family provide integrated transceivers with 14.1‑Gbps data-rate capability for backplane and optical interface applications.
  • I/O and package — 432 user I/O pins in a 1152‑BBGA (FCBGA) supplier package format (1152‑FBGA, 35×35 mm) for dense board-level integration; surface-mount mounting type.
  • Power — Core supply operating range 820 mV to 880 mV to match system power-rail planning.
  • Thermal and grade — Industrial grade with an operating temperature range of −40°C to 100°C for use across extended-temperature environments.
  • Compliance — RoHS‑compliant device suitable for environmentally regulated designs.

Typical Applications

  • High-performance DSP systems — Use the device’s large DSP block count and embedded memory for signal filtering, FFTs, and other compute-intensive algorithms.
  • Optical and backplane interfaces — Integrated transceivers with 14.1‑Gbps capability enable high-speed backplane and optical link implementations.
  • Network and packet processing — Combine abundant logic elements and on-chip RAM for packet buffering, classification, and protocol handling in networking equipment.
  • Military and broadcast systems — Industrial-grade temperature range and FCBGA packaging support deployment in demanding communications and broadcast applications.

Unique Advantages

  • Large programmable fabric: 236,000 logic elements provide the capacity to implement complex custom logic, accelerators, and control functions without external ASICs.
  • Significant on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces external memory dependence and improves data-path latency.
  • Strong DSP throughput: High counts of 18×18 and 27×27 multipliers accelerate fixed- and variable-precision signal processing workloads.
  • High-speed I/O integration: 432 I/O and integrated transceivers simplify board-level design for high-bandwidth interfaces.
  • Industrial temperature qualification: −40°C to 100°C operating range enables use in extended-temperature and ruggedized systems.
  • Compact, manufacturable package: 1152‑BBGA (35×35 mm) FCBGA surface-mount package supports high-density PCB integration and automated assembly.

Why Choose 5SGSMD3H2F35I2LN?

The 5SGSMD3H2F35I2LN positions itself as a high-capacity, DSP-oriented Stratix V GS FPGA combining sizable logic resources, substantial embedded memory, and dedicated DSP multipliers with integrated transceiver capability. Its industrial-grade temperature range and compact FCBGA package make it suitable for demanding, bandwidth- and compute-centric designs that require on-chip memory and signal-processing acceleration.

Design teams targeting data-intensive communications, high-performance computing, or broadcast and military signal-processing systems can leverage this device’s balance of logic, memory, DSP, and I/O to reduce external components, streamline board design, and scale performance within the Stratix V family architecture.

Request a quote or submit a request for pricing and availability to evaluate 5SGSMD3H2F35I2LN for your next design.

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