5SGSMD3H2F35I2LG

The 5SGSMD3H2F35I2LG is a Stratix V GS family field programmable gate array (FPGA) from Intel, supplied in a 1152-ball FCBGA package (35×35). It delivers a large programmable logic fabric combined with substantial on-chip memory and high I/O density for industrial-grade systems.

Key attributes include approximately 236,000 logic elements, roughly 13.3 Mbits of embedded memory, 432 I/O pins, and an operating temperature range of −40 °C to 100 °C, making it suitable for industrial applications that require high logic capacity and robust environmental performance.

Key Features

• Logic Capacity  Approximately 236,000 logic elements providing extensive resources for complex digital designs.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density  432 general-purpose I/O pins to support wide parallel interfaces and board-level connectivity.
• Package  1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), surface-mount mounting for compact, high-density PCB designs.
• Power and Core Voltage  Core supply range from 820 mV to 880 mV for the device core power domain.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  High logic capacity and extended temperature range suit complex control systems and factory automation equipment.
• High-Density Digital Processing  Large logic and embedded memory resources support compute- and pipeline-intensive digital signal processing tasks.
• Connectivity and I/O Aggregation  High I/O count enables aggregation of multiple parallel interfaces and board-level connectivity functions.
• Embedded System Platforms  Surface-mount FCBGA package and extensive on-chip resources support compact embedded platforms requiring significant programmable logic.

Unique Advantages

• Substantial Logic Resources: Approximately 236,000 logic elements enable implementation of large, complex logic designs without external acceleration.
• Generous On-Chip Memory: About 13.3 Mbits of embedded RAM reduces dependency on external memory for buffering and local data storage.
• High I/O Count: 432 I/Os provide design flexibility for interfacing with sensors, peripherals, and board-level buses.
• Industrial-Grade Operation: −40 °C to 100 °C operating range supports deployment in demanding industrial environments.
• Compact, High-Density Packaging: 1152-ball FCBGA (35×35) supports high-pin-count designs in a compact footprint for space-constrained PCBs.
• Low-Voltage Core: 820 mV–880 mV supply supports the device core power domain requirements for system power budgeting.

Why Choose 5SGSMD3H2F35I2LG?

The 5SGSMD3H2F35I2LG combines large programmable logic capacity, multi-megabit embedded memory, and a high I/O count in an industrial-grade FCBGA package. These attributes make it well-suited for designers who need a robust, compact FPGA platform for complex digital processing, I/O-intensive subsystems, and industrial applications requiring extended temperature operation.

As a member of the Stratix V GS family from Intel, the device is backed by documented electrical and switching characteristics and is supplied in a high-density package that supports compact system integration and long-term deployment in industrial environments.

Request a quote or submit an inquiry to evaluate 5SGSMD3H2F35I2LG for your next high-density FPGA design.