5SGSMD3H2F35I3N

The 5SGSMD3H2F35I3N is an Intel Stratix® V GS field programmable gate array (FPGA) in a 1152‑FBGA (35×35) package. It provides a high‑density programmable fabric with 236,000 logic elements and substantial on‑chip memory, suited for designs that require large logic capacity, extensive I/O, and industrial temperature operation.

Key value propositions include large embedded memory (approximately 13.31 Mbits), a high I/O count (432 pins), and support for industrial operating temperatures (−40 °C to 100 °C), enabling robust deployment in demanding systems.

Key Features

• Logic Capacity — 236,000 logic elements to implement large custom digital functions and complex finite‑state machines.
• Embedded Memory — Approximately 13.31 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage to support high‑throughput data paths.
• I/O Density — 432 I/O pins for multi‑channel interfaces, parallel data buses, and dense board integration.
• Package — 1152‑BBGA (FCBGA) supplier device package: 1152‑FBGA (35×35) for compact, high‑pin‑count board designs.
• Power Supply — Core voltage range from 820 mV to 880 mV to match system power budgets and regulator designs.
• Temperature Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Mounting — Surface‑mount device suitable for modern PCBA assembly and automated placement.

Typical Applications

• High‑density custom logic — Implement large custom RTL blocks and complex control logic leveraging 236,000 logic elements and abundant embedded RAM.
• Multi‑interface gateways — Drive boards that require many parallel and serial interfaces using the device’s 432 I/O pins.
• Industrial systems — Use in industrial control, monitoring, and automation applications where operation across −40 °C to 100 °C is required.
• Protocol bridging and buffering — On‑chip memory capacity supports buffering, packet assembly, and protocol conversion tasks within system endpoints.

Unique Advantages

• Large programmable fabric: 236,000 logic elements reduce the need for multiple devices or external glue logic, simplifying system architecture.
• Substantial on‑chip RAM: Approximately 13.31 Mbits of embedded memory supports deep FIFOs and local data processing that improve throughput and latency.
• High I/O count: 432 I/Os enable complex board‑level routing and support for numerous peripheral channels without external expanders.
• Industrial temperature rating: Operation from −40 °C to 100 °C ensures reliability in temperature‑sensitive deployments.
• Compact high‑pin package: The 1152‑FBGA (35×35) package delivers high pin count in a space‑efficient footprint for dense system designs.
• Controlled core supply range: 820–880 mV core voltage simplifies power‑supply design and matching with low‑voltage regulator solutions.

Why Choose 5SGSMD3H2F35I3N?

The 5SGSMD3H2F35I3N brings together a high‑capacity Stratix® V GS FPGA fabric, substantial embedded memory, and a large I/O complement in a compact 1152‑FBGA package. Its industrial temperature rating and defined core voltage range make it a practical choice for designers who need predictable electrical characteristics and deployment in demanding environments.

This device is suited to development teams and procurement teams targeting scalable, high‑density FPGA solutions for applications that require significant logic, memory, and I/O resources while maintaining industrial robustness and streamlined board integration.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and integration support for the 5SGSMD3H2F35I3N.