5SGSMD3H3F35C2LG

The 5SGSMD3H3F35C2LG is a Stratix® V GS Field Programmable Gate Array (FPGA) IC in a 1152‑BBGA FCBGA package. It delivers substantial programmable logic capacity combined with a high I/O count and embedded memory to support complex digital designs.

Targeted at commercial-grade applications, this device is appropriate for designs that require large programmable logic resources, significant on‑chip RAM, and dense board integration with a surface-mount 1152‑FBGA (35×35) package.

Key Features

• Core Logic — 236,000 logic elements (LEs) provide a high-capacity fabric for complex custom logic and datapath implementation.
• Embedded Memory — Approximately 13.3 Mbits of on‑chip RAM to support large buffering, FIFOs, and on‑chip data storage.
• I/O Density — 432 user I/O pins enable extensive external device interfacing and high pin-count board connectivity.
• Power Supply — Core voltage supply range from 820 mV to 880 mV for regulated core operation.
• Package & Mounting — Surface-mount 1152‑BBGA (supplier package: 1152‑FBGA, 35×35) for compact, high-density PCB layouts.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant for global environmental requirements.

Typical Applications

• High-density digital processing — Use the large logic capacity and embedded RAM for complex custom algorithms, data aggregation, and parallel processing tasks.
• Interface aggregation and bridging — The 432 I/Os support dense connectivity for protocol translation, bus bridging, and multi-channel I/O aggregation.
• Board-level integration — The 1152‑FBGA package and surface-mount mounting enable compact, high-density PCB designs where area and pin count matter.

Unique Advantages

• Large programmable fabric: 236,000 logic elements give designers the headroom to implement complex logic, custom accelerators, and wide datapaths without external logic.
• Significant on‑chip RAM: Approximately 13.3 Mbits of embedded memory reduces dependence on external memory for buffering and local storage.
• High I/O count: 432 I/Os simplify system-level interconnect and reduce the need for external I/O expanders.
• Compact package: 1152‑BBGA / 1152‑FBGA (35×35) packaging facilitates high-density board layouts and streamlined BOMs for space-constrained designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for mainstream commercial applications and deployments.
• Regulatory readiness: RoHS compliance supports environmentally conscious product design and global marketability.

Why Choose 5SGSMD3H3F35C2LG?

The 5SGSMD3H3F35C2LG positions itself as a high-capacity, commercial-grade Stratix V GS FPGA optimized for designs that demand extensive programmable logic, substantial embedded memory, and a high I/O count in a compact surface-mount package. Its combination of 236,000 logic elements, approximately 13.3 Mbits of on‑chip RAM, and 432 I/Os provides designers with the integration and flexibility to consolidate functions and reduce external components.

Backed by Stratix V device documentation covering electrical and switching characteristics, this device is suited for engineering teams building complex digital systems that require scalable logic resources, dense connectivity, and a compact board footprint.

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