5SGSMD3H3F35C2LN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 193 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H3F35C2LN – Stratix® V GS FPGA, 236,000 logic elements, 1152-BBGA

The 5SGSMD3H3F35C2LN is an Intel Stratix® V GS field-programmable gate array (FPGA) supplied in a 1152-BBGA surface-mount package. It is built on the Stratix V architecture and is targeted at DSP-centric, transceiver-enabled, and data-intensive applications.

With an enhanced core architecture, integrated hard IP blocks and high-speed transceiver capability inherent to the Stratix V family, this device delivers a balance of high logic capacity, on-chip memory, and DSP resources for demanding compute and bandwidth-centric systems.

Key Features

  • Core architecture  Built on the Stratix V device architecture with enhanced adaptive logic modules and a comprehensive fabric clocking network as described for the family.
  • Logic capacity  Provides 236,000 logic elements for complex programmable logic and control functions.
  • Embedded memory  Approximately 13.3 Mbits of on-chip RAM (13,312,000 bits) organized in 20 Kbit M20K memory blocks for buffering, packet storage, and intermediate data.
  • DSP resources  Stratix V GS devices include abundant variable-precision DSP blocks, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-precision signal processing.
  • Integrated transceivers  GS devices in the Stratix V family offer integrated transceivers with 14.1-Gbps data-rate capability for backplane and optical interface applications.
  • I/O and packaging  432 user I/O pins in a 1152-BBGA (supplier package: 1152-FBGA, 35×35) surface-mount package to support dense board-level connectivity.
  • Power  Core supply operating range specified at 820 mV to 880 mV for device power planning.
  • Operating conditions & grade  Commercial-grade device with an operating temperature range of 0°C to 85°C.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑performance DSP systems  Leverage the variable-precision DSP blocks and large multiplier array for signal processing, filtering, and real-time compute tasks.
  • Transceiver-based communications  Use integrated 14.1-Gbps transceivers and abundant on-chip memory for backplane, optical interface, and packet-processing applications.
  • Data‑intensive networking  Support 40G/100G and other high-bandwidth data paths where logic density and memory bandwidth are required.
  • Broadcast and compute acceleration  Apply the device’s DSP and memory resources to video processing, encoding, and compute acceleration workloads.
  • Prototype to ASIC flow  Prototype designs on Stratix V GS FPGAs with the option to migrate to HardCopy V ASICs for higher-volume production.

Unique Advantages

  • High programmable capacity: 236,000 logic elements provide the silicon real estate needed for complex control, protocol, and processing functions.
  • Significant on-chip memory: Approximately 13.3 Mbits of embedded RAM reduce external memory dependence and lower system-level latency.
  • DSP‑focused architecture: A large array of variable-precision DSP blocks and multipliers enables high-precision, high-throughput digital signal processing inside the FPGA fabric.
  • Integrated high-speed I/O: 432 I/O pins plus integrated transceivers simplify board-level design for high-bandwidth interfaces.
  • Production scalability: Stratix V devices support a low-risk path to HardCopy V ASICs for cost-effective migration from prototype to production.
  • Commercial readiness: Surface-mount 1152-BBGA packaging and RoHS compliance streamline assembly and regulatory requirements for commercial products.

Why Choose 5SGSMD3H3F35C2LN?

The 5SGSMD3H3F35C2LN delivers a balanced combination of logic density, embedded memory, DSP horsepower, and transceiver capability within the Stratix V GS family. It is suited to engineers designing transceiver-enabled, DSP‑centric, and data-intensive systems that require on-chip compute and memory resources in a commercial-grade FPGA.

Supported by Stratix V device documentation and the documented HardCopy migration path, this device offers a practical solution for teams that need both a high-performance prototyping platform and a clear route to volume production.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the 5SGSMD3H3F35C2LN.

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