5SGSMD3H3F35C2WN

The 5SGSMD3H3F35C2WN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-BBGA (1152-FBGA, 35×35) package. This commercial-grade FPGA combines high logic density, substantial on-chip RAM, and a large user I/O count to address complex programmable-logic and I/O-intensive designs.

Designed for surface-mount assembly and commercial temperature operation, the device targets applications that require significant embedded memory, extensive I/O connectivity, and flexible core voltage operation within the specified supply range.

Key Features

• Core logic  Approximately 236,000 logic elements for implementing large-scale digital designs and custom accelerators.
• Embedded memory  Approximately 13.3 Mbits of on-chip RAM (13,312,000 bits) to support buffering, on-chip data structures, and fast local storage.
• I/O capability  432 user I/Os to support dense external interfaces and parallel connectivity.
• Power and voltage  Core supply voltage range from 870 mV to 930 mV to match system power-rail designs and optimize core power delivery.
• Package and mounting  1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35); surface-mount device suitable for board-level integration.
• Operating conditions  Commercial-grade operation with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS-compliant to meet common lead-free manufacturing requirements.

Typical Applications

• High-density digital signal processing  Implement complex DSP pipelines and custom logic blocks using the device’s large logic-element count and embedded RAM.
• I/O-intensive interface bridging  Use the 432 user I/Os to consolidate multiple external buses, sensors, or parallel interfaces without excessive external logic.
• Data buffering and on-chip storage  Leverage approximately 13.3 Mbits of embedded memory for frame buffering, packet staging, or local data caches.
• Commercial embedded systems  Suitable for commercial temperature applications where surface-mount integration and high integration density are required.

Unique Advantages

• High logic density: 236,000 logic elements enable implementation of large and complex programmable designs on a single device, reducing system-level component count.
• Significant on-chip RAM: Approximately 13.3 Mbits of embedded memory reduces dependence on external memory for many buffering and caching tasks.
• Large I/O complement: 432 user I/Os simplify interfacing to multiple peripherals and parallel buses, minimizing external multiplexing and glue logic.
• Compact BGA package: 1152-FBGA (35×35) packaging provides a compact footprint for high-density PCB designs while supporting surface-mount assembly.
• Commercial temperature qualification: Rated for 0 °C to 85 °C operation to meet typical commercial embedded system requirements.
• RoHS compliance: Environmentally compliant for lead-free assembly processes.

Why Choose 5SGSMD3H3F35C2WN?

The 5SGSMD3H3F35C2WN provides a balanced combination of high logic capacity, substantial embedded RAM, and a large number of user I/Os in a compact BGA package. Its commercial-grade operating range and surface-mount form factor make it well suited for developers building board-level systems that require on-chip resources to reduce external components and simplify system architecture.

This FPGA is appropriate for teams and projects that need on-chip storage and dense programmable logic alongside extensive I/O connectivity, backed by Intel’s Stratix V documentation and specifications for electrical and switching characteristics.

Request a quote or submit a procurement inquiry to discuss availability, lead times, and pricing for the 5SGSMD3H3F35C2WN.