5SGSMD3H3F35C3G

The 5SGSMD3H3F35C3G is a Stratix V GS Field Programmable Gate Array (FPGA) IC offered in a 1152‑BBGA, FCBGA package. It is a commercial‑grade, surface‑mount programmable device that delivers substantial on‑chip logic and memory resources for complex digital designs.

With 236,000 logic elements, 432 general‑purpose I/O pins, and approximately 13.3 Mbits of embedded RAM, this device targets designs that require high logic density, significant embedded memory, and large I/O connectivity while operating in standard commercial temperature ranges.

Key Features

• Core Logic Capacity 236,000 logic elements for implementing large, complex digital functions and custom hardware acceleration.
• Embedded Memory Approximately 13.3 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Resources 432 I/Os to support extensive peripheral interfacing and system connectivity in high‑pin‑count designs.
• Supply Voltage Core voltage range 820 mV to 880 mV for the device core.
• Package & Mounting 1152‑BBGA, FCBGA package (supplier device package listed as 1152‑FBGA (35x35)), designed for surface‑mount PCB assembly.
• Operating Conditions & Grade Commercial grade, rated for 0 °C to 85 °C operating temperature.
• Regulatory Compliance RoHS compliant.

Typical Applications

• High‑density digital processing — Implement large custom datapaths and hardware accelerators using the 236,000 logic elements and abundant on‑chip RAM.
• High‑I/O control and routing — Leverage 432 I/Os for complex control planes, multi‑interface bridging, and extensive peripheral connectivity.
• Prototyping and evaluation — Commercial‑grade FPGA suitable for development platforms and proofs of concept that require significant logic and memory resources.

Unique Advantages

• High logic density: 236,000 logic elements enable consolidation of large functions into a single device, simplifying system architecture.
• Substantial on‑chip memory: Approximately 13.3 Mbits of embedded RAM reduces external memory needs for many buffering and storage tasks.
• Extensive I/O availability: 432 I/Os provide flexible interfacing options, lowering the need for additional I/O expanders.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant to meet standard commercial production requirements.
• Compact, high‑pin package: 1152‑BBGA / 1152‑FBGA (35x35) package supports high‑density PCB layouts while maintaining surface‑mount compatibility.

Why Choose 5SGSMD3H3F35C3G?

The 5SGSMD3H3F35C3G positions itself as a high‑capacity, commercial‑grade Stratix V GS FPGA suited to designers who need large programmable logic resources, significant embedded memory, and a high number of I/Os in a single surface‑mount package. Its combination of 236,000 logic elements, approximately 13.3 Mbits of RAM, and 432 I/Os makes it appropriate for complex digital systems and advanced prototyping efforts.

For teams focused on scalability and integration within commercial temperature environments, this device offers a balance of fabric resources, package density, and regulatory compliance that supports sustained development and production use.

Request a quote or submit a sales inquiry to receive pricing, availability, and additional technical information for the 5SGSMD3H3F35C3G. Refer to the Stratix V device datasheet for detailed electrical and switching characteristics.