5SGSMD3H3F35C4N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 879 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 89000 | Number of Logic Elements/Cells | 236000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13312000 |
Overview of 5SGSMD3H3F35C4N – Stratix® V GS FPGA, 1152-BBGA
The 5SGSMD3H3F35C4N is a Stratix V GS Field Programmable Gate Array (FPGA) in a 1152-BBGA surface-mount package. Built on the Stratix V family architecture, this device targets transceiver-driven, DSP-centric and high-bandwidth applications by combining a large logic fabric, substantial on‑chip memory, and integrated high-speed transceivers.
Key values include high logic capacity, approximately 13.3 Mbits of embedded memory, 432 I/O pins in a compact 35×35 FBGA footprint, and commercial-grade operation from 0 °C to 85 °C with an operating core supply in the 820 mV–880 mV range.
Key Features
- Logic Capacity — Approximately 236,000 logic elements provide a large, flexible fabric for complex custom logic and system integration.
- Embedded Memory — Approximately 13.3 Mbits of on-chip RAM implemented in M20K memory blocks for large buffering, lookup tables, and state storage.
- Variable-Precision DSP — Stratix V GS family devices include abundant variable-precision DSP resources (family-level capability up to 3,926 18×18 or 1,963 27×27 multipliers) for high-performance signal processing workloads.
- Integrated Transceivers — Family-level support for integrated transceivers with 14.1-Gbps data-rate capability suitable for backplane and optical interfaces.
- Process and Fabric — Based on the Stratix V family architecture and 28-nm process technology, with multi-track routing and comprehensive fabric clocking (family-level description).
- Package and I/O — 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), with 432 available I/O for dense board-level connectivity. Mounting type: surface mount.
- Power and Temperature — Core supply specified 820 mV to 880 mV; commercial operating temperature range 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- High-performance DSP systems — Use the device’s large DSP resource set and embedded memory for signal processing tasks such as filtering, FFTs, and high-precision arithmetic.
- Optical and Backplane Interfaces — Integrated transceivers (family-level capability at 14.1 Gbps) enable high-speed serial links for 40G/100G and similar interfaces.
- Packet and Network Processing — Large logic capacity and abundant on-chip RAM support packet parsing, buffering, and custom traffic management functions.
- Broadcast and Military Communications — Transceiver-backed DSP functionality supports demanding modulation, encoding/decoding and channel-processing tasks.
Unique Advantages
- High logic density: Approximately 236,000 logic elements let you integrate complex custom logic and multiple subsystems on a single FPGA, reducing external component count.
- Significant on-chip memory: Approximately 13.3 Mbits of embedded RAM minimizes external DRAM dependency for buffering and LUT storage.
- DSP-centric architecture: Family-level variable-precision DSP blocks provide flexible multiplier resources tailored to signal-processing workloads.
- Integrated high-speed I/O: 432 I/O pins in a 1152-BBGA package enable dense board-level connectivity for high-bandwidth interfaces.
- Commercial-grade deployment: Specified 0 °C to 85 °C operation and RoHS compliance for standard commercial applications and manufacturing flow.
Why Choose 5SGSMD3H3F35C4N?
The 5SGSMD3H3F35C4N combines a large logic fabric, ample embedded memory, DSP-oriented resources, and family-level high-speed transceiver capability in a compact 1152-BBGA package. It is well suited for engineers designing transceiver-heavy, DSP-focused systems that require high integration and on-chip memory to reduce system complexity.
This Stratix V GS device is appropriate for teams building high-bandwidth communications equipment, advanced signal-processing platforms, and network processing hardware where sustained performance and a rich development ecosystem matter for scalable production designs.
Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time details for the 5SGSMD3H3F35C4N.

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