5SGSMD3H3F35C4N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 879 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H3F35C4N – Stratix® V GS FPGA, 1152-BBGA

The 5SGSMD3H3F35C4N is a Stratix V GS Field Programmable Gate Array (FPGA) in a 1152-BBGA surface-mount package. Built on the Stratix V family architecture, this device targets transceiver-driven, DSP-centric and high-bandwidth applications by combining a large logic fabric, substantial on‑chip memory, and integrated high-speed transceivers.

Key values include high logic capacity, approximately 13.3 Mbits of embedded memory, 432 I/O pins in a compact 35×35 FBGA footprint, and commercial-grade operation from 0 °C to 85 °C with an operating core supply in the 820 mV–880 mV range.

Key Features

  • Logic Capacity — Approximately 236,000 logic elements provide a large, flexible fabric for complex custom logic and system integration.
  • Embedded Memory — Approximately 13.3 Mbits of on-chip RAM implemented in M20K memory blocks for large buffering, lookup tables, and state storage.
  • Variable-Precision DSP — Stratix V GS family devices include abundant variable-precision DSP resources (family-level capability up to 3,926 18×18 or 1,963 27×27 multipliers) for high-performance signal processing workloads.
  • Integrated Transceivers — Family-level support for integrated transceivers with 14.1-Gbps data-rate capability suitable for backplane and optical interfaces.
  • Process and Fabric — Based on the Stratix V family architecture and 28-nm process technology, with multi-track routing and comprehensive fabric clocking (family-level description).
  • Package and I/O — 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), with 432 available I/O for dense board-level connectivity. Mounting type: surface mount.
  • Power and Temperature — Core supply specified 820 mV to 880 mV; commercial operating temperature range 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-performance DSP systems — Use the device’s large DSP resource set and embedded memory for signal processing tasks such as filtering, FFTs, and high-precision arithmetic.
  • Optical and Backplane Interfaces — Integrated transceivers (family-level capability at 14.1 Gbps) enable high-speed serial links for 40G/100G and similar interfaces.
  • Packet and Network Processing — Large logic capacity and abundant on-chip RAM support packet parsing, buffering, and custom traffic management functions.
  • Broadcast and Military Communications — Transceiver-backed DSP functionality supports demanding modulation, encoding/decoding and channel-processing tasks.

Unique Advantages

  • High logic density: Approximately 236,000 logic elements let you integrate complex custom logic and multiple subsystems on a single FPGA, reducing external component count.
  • Significant on-chip memory: Approximately 13.3 Mbits of embedded RAM minimizes external DRAM dependency for buffering and LUT storage.
  • DSP-centric architecture: Family-level variable-precision DSP blocks provide flexible multiplier resources tailored to signal-processing workloads.
  • Integrated high-speed I/O: 432 I/O pins in a 1152-BBGA package enable dense board-level connectivity for high-bandwidth interfaces.
  • Commercial-grade deployment: Specified 0 °C to 85 °C operation and RoHS compliance for standard commercial applications and manufacturing flow.

Why Choose 5SGSMD3H3F35C4N?

The 5SGSMD3H3F35C4N combines a large logic fabric, ample embedded memory, DSP-oriented resources, and family-level high-speed transceiver capability in a compact 1152-BBGA package. It is well suited for engineers designing transceiver-heavy, DSP-focused systems that require high integration and on-chip memory to reduce system complexity.

This Stratix V GS device is appropriate for teams building high-bandwidth communications equipment, advanced signal-processing platforms, and network processing hardware where sustained performance and a rich development ecosystem matter for scalable production designs.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time details for the 5SGSMD3H3F35C4N.

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