5SGSMD3H3F35I3L

The 5SGSMD3H3F35I3L is a Stratix® V GS field-programmable gate array (FPGA) IC in a 1152‑BBGA FCBGA package. It integrates 236,000 logic elements and approximately 13.3 Mbits of embedded memory, providing a high-density platform for complex logic and memory‑intensive designs.

Targeted for industrial applications, this device offers 432 I/O pins, a surface-mount 1152‑FBGA (35×35) package, a core voltage supply range of 0.820–0.880 V, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core & Logic  236,000 logic elements and approximately 89,000 logic blocks (CLB count) provide large programmable fabric for parallel processing and custom hardware implementation.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage without external memory for many functions.
• I/O and Package  432 I/O pins in a 1152‑BBGA FCBGA package with surface-mount mounting; supplier package listed as 1152‑FBGA (35×35) for high-density board designs.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail planning and power-supply design.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for temperature‑sensitive deployments.
• Standards Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use the device’s industrial temperature rating, large logic capacity, and extensive I/O to implement motion control, PLC logic, and factory automation interfaces.
• Signal Processing & Acceleration  High logic element count and on-chip RAM enable hardware-accelerated signal processing pipelines, real-time data path implementations, and algorithm offload.
• Communication & Networking Systems  Dense logic fabric and abundant I/O support protocol handling, packet processing, and custom interface bridging in networking equipment.
• Advanced Embedded Systems  Integration of large programmable logic and memory allows consolidation of multiple functions onto a single FPGA for compact embedded platforms.

Unique Advantages

• High integration density: 236,000 logic elements and ~13.3 Mbits of embedded RAM reduce the need for external components and simplify system partitioning.
• Industrial operating range: Rated for −40 °C to 100 °C, enabling deployment in demanding temperature environments.
• Ample I/O capability: 432 I/O pins in a compact 1152‑FBGA package support a variety of interfaces and board-level connections.
• Controlled core power envelope: A defined core supply range of 820–880 mV assists power-supply design and helps ensure consistent device operation.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and regulatory requirements.

Why Choose 5SGSMD3H3F35I3L?

The 5SGSMD3H3F35I3L combines high logic density, substantial embedded memory, and a wide industrial temperature range in a compact 1152‑BBGA package. It is well suited to projects that require consolidated hardware functions, extensive I/O, and robust operation across industrial temperature conditions.

Designers and teams seeking a Stratix® V GS‑class FPGA for scalable logic integration, on-chip memory capacity, and predictable power and thermal characteristics will find this device appropriate for demanding embedded and system‑level implementations.

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