5SGSMD3H3F35I3WN

The 5SGSMD3H3F35I3WN is an industrial-grade Stratix V GS FPGA offering a high-density programmable fabric with extensive embedded memory and I/O resources. It is delivered in a 1152-ball FCBGA package and is designed for applications that require large logic capacity, significant on-chip RAM, and broad I/O connectivity.

Built on the Stratix V family architecture, this device targets demanding digital systems requiring scalable logic integration, robust thermal range, and low-voltage core operation.

Key Features

• Core Logic  Approximately 236,000 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support buffering, state storage, and data-path implementations within the FPGA fabric.
• I/O and Packaging  432 general-purpose I/Os delivered in a surface-mount 1152-ball FCBGA (35×35) package for dense board-level integration and high pin-count connectivity.
• Low-Voltage Core  Specified voltage supply range of 820 mV to 880 mV for core operation, enabling compatibility with low-voltage system architectures.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
• Mounting and Package  Surface-mount device in a 1152-BBGA/FBGA package (35×35 mm outline) for high-density PCB assembly.
• Compliance  RoHS compliant.
• Stratix V Family Characteristics  Part of the Stratix V series, which is offered in commercial and industrial temperature grades and includes GS transceiver options across the family.

Typical Applications

• Industrial Control and Automation  Use the device where industrial temperature range and high logic capacity are required for real-time control, protocol handling, and machine logic.
• High-Density Digital Systems  Implement complex arithmetic, state machines, and custom accelerators leveraging the large logic element count and embedded RAM.
• High I/O Connectivity  Deploy in systems that require numerous parallel or multiplexed interfaces, using the 432 I/Os for sensors, buses, or peripheral connectivity.
• System Prototyping and Integration  Ideal for prototypes and production designs that need significant on-chip resources and a compact BGA package for board-level integration.

Unique Advantages

• High logic density:  Approximately 236,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
• Significant on-chip memory:  Approximately 13.3 Mbits of embedded RAM reduce the need for external memory in many applications, improving throughput and latency.
• Robust I/O count and packaging:  432 I/Os in a 1152-ball FCBGA package offer a balance of pin count and compact footprint for complex interconnect requirements.
• Industrial temperature capability:  Operation from –40 °C to 100 °C supports deployment in environments with wide temperature variation.
• Low-voltage core operation:  Core supply range of 820–880 mV aligns with low-power design practices for modern systems.
• Standards-compliant material:  RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGSMD3H3F35I3WN?

The 5SGSMD3H3F35I3WN delivers a combination of large programmable logic capacity, substantial embedded memory, and broad I/O in a compact FCBGA package, making it well suited for industrial and high-density digital designs. Its industrial temperature rating and low-voltage core range provide design flexibility across a range of operating conditions.

This device is appropriate for engineers and system designers who need to integrate complex logic, on-chip buffering, and high I/O counts into a single FPGA platform while maintaining industrial-grade thermal performance and RoHS compliance.

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