5SGSMD3H3F35I3LN

The 5SGSMD3H3F35I3LN is a Stratix® V GS field-programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35×35). It delivers high on-chip logic capacity and embedded memory with a large I/O count, packaged for surface-mount assembly and rated for industrial temperature operation.

Designed for complex digital designs, this device targets applications that require significant logic resources, substantial embedded RAM, and extensive I/O while operating across a wide temperature range and low core-voltage domain.

Key Features

• High logic capacity — 236,000 logic elements to implement complex combinational and sequential logic functions.
• Substantial embedded memory — Total on-chip RAM of 13,312,000 bits (approximately 13.312 Mbits) for buffering, caching, and on-chip data storage.
• Large I/O count — 432 I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Package and mounting — 1152‑BBGA (FCBGA) surface-mount package, supplier package 1152‑FBGA (35×35), enabling compact, high-density board designs.
• Industrial temperature rating — Specified for operation from –40 °C to 100 °C for use in industrial environments.
• Low-voltage core operation — Core supply range 820 mV to 880 mV to match standard low-voltage FPGA power domains.
• Series-level transceiver support — As part of the Stratix V family, GS devices are offered with defined transceiver speed grades in the Stratix V Device Datasheet.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• Network and telecom equipment — High logic density, abundant embedded RAM, and large I/O counts enable packet processing, protocol offload, and interface aggregation.
• Compute acceleration — Implements complex data-paths and custom acceleration engines using the device’s 236,000 logic elements and on-chip memory.
• Industrial automation and control — Industrial temperature range (–40 °C to 100 °C) and extensive I/O make the device suitable for factory automation, motion control, and PLC applications.
• Test, measurement, and data acquisition — Large I/O and embedded RAM support multi-channel data capture, preprocessing, and real-time analysis.
• Video and broadcast processing — High logic capacity and memory enable image pipeline processing, format conversion, and multi-stream handling.

Unique Advantages

• High integration density: 236,000 logic elements consolidate complex functionality into a single device, reducing component count and board complexity.
• Generous on-chip memory: Approximately 13.312 Mbits of embedded RAM supports buffering and stateful processing without external memory for many use cases.
• Extensive I/O resources: 432 I/Os provide flexibility for parallel interfaces, wide buses, and multi-channel connectivity.
• Industrial readiness: Rated for –40 °C to 100 °C operation to meet the needs of industrial deployments.
• Low-voltage core: 820 mV–880 mV supply aligns with modern low-power FPGA power domains.
• Robust packaging: 1152‑BBGA (35×35) FCBGA package enables a compact layout while supporting high pin counts for dense designs.

Why Choose 5SGSMD3H3F35I3LN?

The 5SGSMD3H3F35I3LN combines substantial logic and memory resources with a high I/O count and industrial temperature rating, making it suitable for demanding embedded, networking, and industrial applications. As a Stratix V GS device from Intel/Altera, it aligns with the Stratix V family documentation for device-level electrical and switching characteristics.

Design teams requiring a high-density, industrial-grade FPGA in a compact FCBGA footprint will find this device appropriate for consolidating complex functionality, accelerating data paths, and supporting broad I/O requirements while operating in harsh environments.

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