5SGSMD3H3F35I3N

The 5SGSMD3H3F35I3N is a Stratix® V GS Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA, FCBGA package. It delivers large programmable logic capacity combined with substantial on-chip memory and a high I/O count for industrial designs.

Designed and rated for industrial operation, this device targets applications that require extensive combinational and sequential logic, on-chip embedded memory, and robust I/O connectivity within a –40 °C to 100 °C operating range.

Key Features

• Core Logic Provides 236,000 logic elements suitable for implementing complex custom logic, state machines, and datapaths.
• Embedded Memory Approximately 13.3 Mbits of on-chip RAM for buffering, LUT-based storage, and embedded memory functions.
• I/O Density 432 available I/O pins to support dense peripheral interfaces, parallel buses, and multiple I/O standards at the board level.
• Power Core supply voltage specified from 820 mV to 880 mV to match system power-rail planning and power-supply design.
• Package 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35 mm) for high-density board mounting and thermal management considerations.
• Temperature & Grade Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS-compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Automation and Control Use the device’s large logic capacity and 432 I/Os for sensor interfacing, motor control logic, and programmable control systems that operate across a wide temperature range.
• Protocol Bridging and Data Aggregation Implement protocol translation and aggregation logic using ample logic elements and on-chip memory for buffering and packet handling.
• High-Density Embedded Processing Deploy the FPGA for custom datapaths, hardware acceleration, and specialized signal processing that benefit from substantial embedded RAM and logic resources.
• Custom I/O and Peripheral Integration Leverage the 432 I/Os to integrate multiple parallel interfaces, front-end sensors, or custom peripherals on a single programmable device.

Unique Advantages

• High Logic Capacity: 236,000 logic elements allow implementation of large-scale custom logic and complex state machines without partitioning across multiple devices.
• Significant On-Chip Memory: Approximately 13.3 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage, simplifying board design.
• Extensive I/O Resources: 432 I/O pins support dense peripheral connectivity, reducing the need for additional interface components.
• Industrial Temperature Rating: Rated from –40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact, High-Density Package: The 1152-BBGA (35×35 mm) package enables high-density PCB layouts while providing a footprint suitable for complex systems.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose 5SGSMD3H3F35I3N?

The 5SGSMD3H3F35I3N combines substantial programmable logic, sizable embedded memory, and a large I/O complement in an industrial-grade Stratix V GS FPGA. Its specification set — including 236,000 logic elements, approximately 13.3 Mbits of RAM, 432 I/Os, and an industrial temperature range — makes it suitable for engineers building high-density, rugged programmable systems where on-chip resources and I/O count are critical design drivers.

As a member of the Stratix V family, this device is positioned for designs that require scalable logic capacity and on-chip memory in demanding operating environments. It is appropriate for teams designing industrial controllers, custom processing engines, protocol bridges, and other applications where integration and reliability are priorities.

Request a quote or contact sales to check availability, pricing, and lead time for the 5SGSMD3H3F35I3N.