5SGSMD3H3F35I3G

The 5SGSMD3H3F35I3G is an Intel Stratix® V GS field programmable gate array (FPGA) offered in an industrial temperature grade. It provides a large pool of programmable logic, embedded memory, and a high number of general-purpose I/O in a ball-grid array package for compact system integration.

This device is suited for industrial designs that require substantial on-chip logic and memory capacity, high I/O density, and operation across an extended temperature range. Key attributes include 236,000 logic elements, approximately 13.3 Mbits of embedded memory, and 432 I/O pins.

Key Features

• FPGA Core 236,000 logic elements for complex, programmable logic implementations.
• Embedded Memory Approximately 13.3 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• High I/O Density 432 I/O signals to support wide peripheral connectivity and multi-channel interfaces.
• Low-Voltage Core Core supply voltage specified from 820 mV to 880 mV to match low-voltage system rails.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Package & Mounting 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35); surface-mount mounting type for compact PCB designs.
• Standards Compliance RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Industrial control systems — Programmable logic and extensive I/O enable motor control, machine automation, and real-time control functions across a wide temperature range.
• Communications and networking — Large on-chip memory and abundant logic elements support buffering, protocol processing, and complex packet handling.
• High-density FPGA-based modules — Compact FCBGA package and surface-mount mounting make this device suitable for modules and mezzanines with constrained board space.

Unique Advantages

• High logic capacity: 236,000 logic elements provide headroom for complex algorithms and multi-function designs.
• Significant on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces dependence on external memory for many applications.
• Extensive I/O: 432 available I/O pins enable broad peripheral connectivity and multi-channel interfaces without external expanders.
• Industrial-rated operation: −40 °C to 100 °C temperature rating supports deployment in harsh environments.
• Compact, board-ready package: 1152-BBGA (FCBGA) in a 35×35 supplier package allows dense routing and surface-mount assembly.
• Low-voltage core compatibility: 820–880 mV supply range aligns with modern low-voltage system architectures.

Why Choose 5SGSMD3H3F35I3G?

The 5SGSMD3H3F35I3G positions itself as a high-capacity, industrial-grade Stratix V GS FPGA designed for applications that need abundant programmable logic, substantial embedded memory, and high I/O count in a compact package. Its electrical and thermal specifications make it appropriate for demanding industrial environments where temperature range and board-space efficiency matter.

Designers looking for scalable logic resources and on-chip memory with RoHS compliance will find this device appropriate for system-level integration where reduced external component count and robust operating margins are important.

Request a quote or submit a pricing inquiry to obtain availability and ordering information for the 5SGSMD3H3F35I3G.