5SGSMD3H3F35C4WN

The 5SGSMD3H3F35C4WN is a Stratix V GS Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152‑ball FCBGA package (35 × 35 mm). This device provides a high count of programmable logic and on‑chip memory with a large number of I/O, targeting designs that require substantial logic capacity, embedded memory, and dense I/O integration.

Electrical and switching characteristics for the Stratix V family are documented in the Stratix V Device Datasheet; this device is specified for commercial temperature operation and RoHS compliance.

Key Features

• Logic Resources  236,000 logic elements (logic element cells) for implementing complex digital functions and large custom logic networks.
• Embedded Memory  Approximately 13.3 Mbits of embedded memory to support buffering, packet processing, and on‑chip data storage.
• I/O Capacity  432 user I/O pins to support wide parallel interfaces, multiple memory channels, and dense board connectivity.
• Power and Core Voltage  Specified core supply range of 0.820 V to 0.880 V, enabling designs that target the Stratix V core voltage envelope.
• Package & Mounting  1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35 × 35 mm); surface‑mount mounting for compact, high‑density PCB layouts.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental conformity.

Typical Applications

• High‑density logic implementations  Deploy complex state machines, large custom accelerators, or signal processing pipelines that require extensive programmable logic and on‑chip memory.
• Memory‑centric designs  Leverage the device’s embedded memory for buffering, packet handling, or data staging within system logic.
• High‑I/O interface systems  Use the 432 user I/O pins for wide parallel buses, multi‑lane interfaces, or mixed I/O subsystems requiring many external connections.

Unique Advantages

• Substantial logic density: 236,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board complexity.
• Significant on‑chip memory: Approximately 13.3 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 432 I/Os enable flexible partitioning of interfaces and simplify routing of parallel or multi‑channel systems.
• Compact, surface‑mount package: The 1152‑ball FCBGA (35 × 35 mm) balances package density with board space efficiency for high‑performance designs.
• Commercial grade and RoHS compliant: Electrical and environmental specifications suitable for commercial applications with RoHS conformity.

Why Choose 5SGSMD3H3F35C4WN?

The 5SGSMD3H3F35C4WN delivers a combination of high logic capacity, substantial embedded memory, and a large I/O complement in a compact FCBGA package—making it a strong choice for projects that require integrating multiple high‑complexity functions on a single FPGA. Its specified core voltage range and commercial temperature rating provide clear electrical and operating boundaries for system design.

This device suits engineers and teams building dense digital systems that prioritize on‑chip resources and I/O flexibility. With Stratix V family electrical and switching characteristics documented in the device datasheet, designers can reference detailed operating conditions and timing characteristics when integrating the device into their designs.

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