5SGSMD3H3F35C4G

The 5SGSMD3H3F35C4G is a Stratix® V GS Field Programmable Gate Array (FPGA) from Intel, supplied in a 1152-BBGA FCBGA package. This device provides a high-density programmable fabric with a substantial logic and on-chip memory footprint, making it suitable for complex digital designs that require many I/Os and embedded memory.

Key attributes available from the product data include 236,000 logic elements, approximately 13.3 Mbits of embedded RAM, 432 user I/Os, a low-voltage core supply range (820 mV–880 mV), and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Capacity  236,000 logic elements (cells) provide a large programmable fabric for complex logic implementations.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage inside the FPGA.
• I/O Density  432 general-purpose I/Os to connect with high-pin-count peripherals, daughter cards, and board-level interfaces.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV, enabling integration with low-voltage system power rails.
• Package and Mounting  1152-BBGA (1152-FBGA supplier package, 35×35) in an FCBGA footprint; surface-mount device for standard PCB assembly.
• Temperature and Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital designs  Large logic capacity and on-chip RAM support complex state machines, protocol processing, and custom accelerators.
• Multi‑I/O systems  432 I/Os enable connection to a wide range of peripherals, buses, and mezzanine interfaces on compact boards.
• Embedded memory-intensive functions  Approximately 13.3 Mbits of RAM suits buffering, packet handling, and data staging within the FPGA fabric.

Unique Advantages

• High logic density: 236,000 logic elements provide capacity for large and complex designs without external logic.
• Substantial on‑chip RAM: Approximately 13.3 Mbits of embedded memory reduces dependence on external DRAM for many buffering tasks.
• Extensive I/O count: 432 I/Os simplify integration with multiple high-pin-count peripherals and interfaces.
• Low-voltage core: 820 mV–880 mV core supply range aligns with modern low-voltage power architectures.
• Compact ball-grid package: 1152-BBGA (35×35) FCBGA offers a dense board footprint for space-constrained system designs.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose 5SGSMD3H3F35C4G?

The 5SGSMD3H3F35C4G combines a large logic fabric, significant embedded memory, and a high I/O count in a compact 1152‑BBGA package, making it appropriate for designers who need substantial on-chip resources in a surface-mount form factor. Its low-voltage core supply and RoHS compliance align with modern system and regulatory requirements.

Backed by Intel’s Stratix V device family documentation and specifications, this commercial-grade FPGA is suited to teams building complex programmable logic solutions that require scalability, integration, and clear device-level specifications.

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