5SGSMD3H3F35C3N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 788 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H3F35C3N – Stratix® V GS FPGA, approximately 236,000 logic elements, 432 I/O

The 5SGSMD3H3F35C3N is a Stratix® V GS field programmable gate array optimized for DSP‑centric and transceiver‑based designs. Built on the Stratix V family architecture, this device combines a high‑density logic fabric with abundant embedded memory and integrated transceiver capability to address bandwidth‑ and compute‑intensive applications.

Typical market segments for this GS variant include high‑performance digital signal processing, wireline and optical communications, broadcast, and compute‑intensive network systems where integrated transceivers and variable‑precision DSP resources accelerate system design.

Key Features

  • Logic Fabric — Approximately 236,000 logic elements provide the capacity for complex custom logic, protocol handling, and system orchestration.
  • Embedded Memory — Approximately 13.3 Mbits of on‑chip RAM implemented with 20 Kbit (M20K) memory blocks for buffering, lookup tables, and state storage.
  • High‑performance DSP Resources — Stratix V GS devices include variable‑precision DSP blocks and support for large multiplier arrays (family‑level support up to 3,926 18×18 or 1,963 27×27 multipliers), enabling wide dynamic range and high‑throughput signal processing.
  • Integrated Transceivers — GS family devices offer integrated transceivers with up to 14.1 Gbps data‑rate capability, suitable for backplane and optical interfaces.
  • I/O and Packaging — 432 I/O pins in a 1152‑BBGA (35×35) FCBGA package, surface‑mount for compact board implementations.
  • Power and Voltage — Core supply range specified at 820 mV to 880 mV for the device.
  • Operating Conditions — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
  • Embedded Hard IP and System Blocks — Family architecture includes fractional PLLs and Embedded HardCopy Block for hard IP instantiation (PCIe Gen1/Gen2/Gen3 path via family features).

Typical Applications

  • High‑Performance DSP Systems — Implements multi‑channel filtering, FFTs, and precision arithmetic using variable‑precision DSP blocks and large multiplier arrays.
  • Wireline and Optical Communications — Supports backplane and optical interfaces with integrated transceivers up to 14.1 Gbps for line cards and transport equipment.
  • Broadcast and Video Processing — On‑chip memory and DSP resources enable real‑time video processing pipelines and format conversion.
  • Network and Packet Processing — High logic density and ample I/O support packet inspection, traffic management, and custom protocol acceleration.

Unique Advantages

  • High DSP Throughput: Variable‑precision DSP blocks and family support for thousands of multipliers enable dense, high‑speed signal processing implementations.
  • Integrated Transceiver Capability: Built‑in transceivers rated for up to 14.1 Gbps (GS family) reduce external SerDes requirements and simplify board design for high‑bandwidth links.
  • Significant On‑Chip Memory: Approximately 13.3 Mbits of embedded RAM (M20K blocks) for buffering and on‑chip data storage reduces external memory dependence.
  • Compact High‑I/O Package: 1152‑ball BGA (35×35) package with 432 I/O brings high connectivity in a space‑efficient footprint.
  • Production Path to HardCopy ASICs: Stratix V family supports a low‑risk migration path to HardCopy V ASICs for higher‑volume production (family‑level capability).
  • Standards‑aware Architecture: Family features such as fractional PLLs and embedded hard IP blocks facilitate implementation of common high‑speed protocols and timing architectures.

Why Choose 5SGSMD3H3F35C3N?

The 5SGSMD3H3F35C3N delivers a balance of dense logic, substantial embedded memory, and integrated transceiver and DSP resources tailored for DSP‑centric and high‑bandwidth systems. Its commercial operating range, surface‑mount 1152‑BGA package, and RoHS compliance make it suitable for a wide range of production applications where on‑chip compute and I/O density matter.

This Stratix V GS device suits design teams building signal processing, communications, and high‑performance compute modules that benefit from a single‑chip combination of logic, memory, and transceivers, with a documented family migration path to HardCopy ASICs for volume production.

Request a quote or submit a procurement inquiry today to evaluate 5SGSMD3H3F35C3N for your next high‑performance FPGA design.

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