5SGSMD3H3F35C2N

The 5SGSMD3H3F35C2N is a Stratix V GS-series FPGA in a 1152-BBGA (35 × 35) FCBGA package. It is built on a 28-nm process with an enhanced core architecture and is targeted at high-performance, DSP-centric and transceiver-based designs.

This device provides a large fabric with 236,000 logic elements, approximately 13.3 Mbits of embedded memory, and 432 I/Os, making it suitable for bandwidth- and data-intensive applications that benefit from integrated DSP resources and hard IP blocks.

Key Features

• Process and core — 28-nm device architecture with an enhanced core design and core voltage options referenced in the family documentation.
• Logic capacity — 236,000 logic elements to implement complex custom logic and control functions.
• Embedded memory — Total on-chip RAM of 13,312,000 bits (approximately 13.3 Mbits) using M20K memory blocks for data buffering and state storage.
• DSP resources — GS-family devices include variable-precision DSP blocks; the Stratix V GS family supports up to 3,926 18×18 or 1,963 27×27 multipliers as documented for the family.
• I/O density — 432 I/Os for high-pin-count interfaces and multi-channel connectivity.
• Power supply — Core voltage supply range specified at 870 mV to 930 mV.
• Package — 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35 × 35) for compact, high-density board designs.
• Operating range and grade — Commercial grade device specified for 0 °C to 85 °C operation.
• Compliance — RoHS-compliant.

Typical Applications

• High-performance DSP systems — Variable-precision DSP blocks and abundant embedded memory enable complex signal processing tasks for broadcast and compute applications.
• High-bandwidth communications — Large I/O count and family-level transceiver capabilities address backplane, optical, and packet-processing interfaces for 40G/100G-class systems.
• PCI Express and protocol acceleration — Family documentation notes hard IP support including hardened PCIe implementations useful for protocol offload and acceleration.
• Network and test equipment — Logic density, memory, and DSP resources suit packet processing, traffic management, and network test applications.

Unique Advantages

• High logic and memory integration: 236,000 logic elements and roughly 13.3 Mbits of on-chip RAM reduce external component needs for control and buffering functions.
• DSP-centric architecture: GS-series variable-precision DSP blocks provide dedicated multiply resources for high-throughput signal processing tasks.
• Dense I/O and compact packaging: 432 I/Os in a 1152-BBGA FCBGA footprint enable high-channel-count designs in a manageable board area.
• Commercial operating range: Rated from 0 °C to 85 °C for a wide range of standard embedded and communications equipment.
• Supply and compliance: Defined core supply window (870 mV–930 mV) and RoHS compliance simplify system power planning and regulatory adherence.

Why Choose 5SGSMD3H3F35C2N?

The 5SGSMD3H3F35C2N combines a high-logic-count fabric, substantial embedded memory, and the Stratix V GS family’s DSP-oriented resources in a compact FCBGA package. It targets designers building bandwidth- and compute-heavy systems who require on-chip memory and dedicated DSP capability alongside a large complement of I/Os.

For teams developing data-path acceleration, high-speed communications interfaces, or advanced signal-processing systems, this device offers an integrated hardware foundation that aligns with scalable Stratix V family features and documented hard-IP options.

Request a quote or submit a purchasing inquiry to get pricing and availability for the 5SGSMD3H3F35C2N and discuss how it fits your design requirements.