5SGSMD3H3F35C2G

The 5SGSMD3H3F35C2G is a Stratix V GS Field Programmable Gate Array (FPGA) supplied in a 1152-FBGA (35×35) package for surface-mount applications. It provides a high-density programmable logic fabric combined with substantial embedded RAM and a large I/O complement, with electrical and switching characteristics documented in the Stratix V device datasheet.

Designed as a commercial-grade device, this FPGA is targeted at designs that require significant logic resources, embedded memory capacity, and high I/O count within a compact FCBGA footprint.

Key Features

• Logic Capacity 236,000 logic elements (cells) and 89,000 LABs/CLBs indicating substantial programmable logic resources for complex designs.
• Embedded Memory Approximately 13.3 Mbits of on-chip RAM to support buffering, packet processing, and intermediate storage without external memory.
• I/O Density 432 user I/O pins to accommodate broad connectivity and interfacing requirements.
• Power Supply Core voltage supply range specified at 870 mV to 930 mV for the device core.
• Package & Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount assembly.
• Operating Grade and Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance RoHS compliant.
• Documented Electrical and Switching Characteristics Electrical, switching, and I/O timing details are available in the Stratix V device datasheet, including transceiver and programmable I/O element specifications for the Stratix V family.

Typical Applications

• High-density programmable logic — Use where large numbers of logic elements and LABs/CLBs are required for implementing complex digital functions.
• On-chip memory-centric designs — Designs that benefit from approximately 13.3 Mbits of embedded RAM for buffering, packet processing, or data staging.
• High I/O integration — Applications that need a large number of I/O pins (432) for interfacing to peripherals, sensors, or parallel buses within a compact package.

Unique Advantages

• High logic density: 236,000 logic elements provide capacity for sophisticated logic implementations without immediate partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 13.3 Mbits of embedded memory reduces reliance on external memory for many buffering and storage needs.
• Broad I/O complement: 432 I/O pins support complex interfacing and multiple parallel interfaces in a single FPGA package.
• Compact FCBGA package: 1152-FBGA (35×35) package enables high integration density while remaining surface-mount compatible.
• Commercial operating range: Specified 0 °C to 85 °C operating temperature and commercial grade classification for standard production environments.
• Fully documented characteristics: Electrical and switching behavior, including I/O timing and transceiver-related information for the Stratix V family, are provided in the device datasheet.

Why Choose 5SGSMD3H3F35C2G?

The 5SGSMD3H3F35C2G positions itself as a high-capacity, commercial-grade FPGA option in the Stratix V GS family, combining extensive logic resources, substantial on-chip RAM, and a large I/O count in a 1152-FBGA surface-mount package. Its documented electrical and switching specifications support informed system-level design and integration.

This device is appropriate for engineers and teams needing a single-chip programmable solution with significant internal resources and a compact package footprint, backed by the detailed device documentation available for the Stratix V family.

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