5SGSMD3H3F35C2L

The 5SGSMD3H3F35C2L is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 1152-BBGA (35×35) FCBGA package. Built on a 28‑nm process, this GS variant targets transceiver-based, DSP‑centric and bandwidth‑focused applications, offering an architecture with integrated transceivers, variable‑precision DSP resources, and configurable hard IP.

This device suits designs requiring large logic capacity, substantial on‑chip memory, and a high number of I/O while operating within a commercial temperature range and low-voltage core supply.

Key Features

• Logic Capacity  Approximately 236,000 logic elements for implementing complex digital logic and control functions.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM (13,312,000 bits) using Stratix V M20K memory blocks for buffering and data storage.
• DSP Resources  Variable‑precision DSP blocks as provided by the Stratix V GS family to support high‑precision multiply operations.
• High‑speed Transceivers  Integrated transceivers (family GS variant) targeted for backplane and optical interfaces; Stratix V family supports high aggregate bandwidth.
• I/O Density  432 I/O pins to interface with external memory, peripherals, and high‑speed links.
• Package and Mounting  1152‑BBGA (FCBGA) supplier device package 1152‑FBGA (35×35), surface mount format for high‑density board designs.
• Power and Operating Range  Core supply range 820 mV to 880 mV; commercial operating temperature 0 °C to 85 °C.
• Standards and Compliance  RoHS compliant.
• Fabric and Clocking  Stratix V family architecture includes multi‑track routing and a comprehensive fabric clocking network for timing flexibility.

Typical Applications

• High‑performance DSP and Signal Processing  GS variant DSP resources and on‑chip memory enable multi‑channel filtering, modulation/demodulation, and other compute‑intensive signal tasks.
• Optical and Backplane Communications  Integrated transceivers and high I/O count support 40G/100G class interfaces and backplane link implementations.
• Packet Processing and Traffic Management  Large logic capacity and embedded memory provide the resources needed for packet inspection, buffering, and high‑throughput packet workflows.
• Broadcast and High‑Performance Computing  Configurable DSP and memory blocks make the device suitable for video processing, encoding/decoding pipelines, and compute acceleration.

Unique Advantages

• Large, Scalable Logic Resource:  Approximately 236,000 logic elements accommodate complex system integration without external glue logic.
• Substantial On‑chip Memory:  About 13.3 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Transceiver‑enabled System Design:  Stratix V GS transceiver integration supports high‑bandwidth interfaces for communications and backplane applications.
• DSP‑centric Architecture:  Variable‑precision DSP blocks provide flexible multiply/accumulate capability for signal processing functions.
• High I/O Count and Dense Packaging:  432 I/O in a 1152‑BBGA FCBGA (35×35) package enables compact, high‑pin‑count board layouts.
• Production Path to HardCopy ASICs:  Stratix V devices support a migration path to HardCopy V ASICs for higher‑volume production scenarios.

Why Choose 5SGSMD3H3F35C2L?

The 5SGSMD3H3F35C2L combines large logic and memory resources, a high I/O count, and Stratix V GS‑class DSP and transceiver capabilities in a commercial‑grade, surface‑mount 1152‑BBGA package. It is well suited for designers implementing transceiver‑based DSP systems, high‑bandwidth communications endpoints, and complex packet or media processing subsystems.

With a 28‑nm Stratix V architecture and a documented production path to HardCopy ASICs, the device provides a route from prototyping to higher‑volume deployment while keeping design integration and board space efficiency in focus.

Request a quote or submit a procurement inquiry to discuss availability, lead times, and pricing for 5SGSMD3H3F35C2L.