5SGSMD3H2F35I3WN

The 5SGSMD3H2F35I3WN is a Stratix® V GS Field Programmable Gate Array (FPGA) device. It delivers large programmable logic capacity and substantial on-chip RAM in a high-density FCBGA package for demanding embedded and industrial applications.

Key characteristics include 236,000 logic elements, approximately 13.3 Mbits of embedded memory, 432 user I/Os, an industrial operating temperature range, and a low-voltage core supply range. These specifications target designs requiring significant integration of logic, memory, and I/O on a single device.

Key Features

• Core Logic Capacity  236,000 logic elements to implement complex, high-density digital designs.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM for buffering, state storage, and algorithm data sets.
• I/O Density  432 user I/Os to support extensive peripheral and board-level connectivity.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package (1152-FBGA, 35×35) in a surface-mount form factor for compact, high-pin-count board designs.
• Power  Core voltage supply range from 820 mV to 880 mV to match low-voltage system architectures.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C for reliability in industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implements complex logic and signal processing pipelines using the device’s large logic element count and on-chip memory.
• Network and communications systems  Supports designs requiring many I/Os and substantial embedded RAM for packet buffering and protocol handling.
• Industrial control and automation  Industrial temperature rating and surface-mount FCBGA package suit robust embedded control systems.
• FPGA-based system integration  Consolidates multiple functions onto a single device to reduce board-level component count and simplify interconnect.

Unique Advantages

• Large programmable logic capacity: 236,000 logic elements provide the headroom for complex functions and dense integration.
• Substantial on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces reliance on external memory for many applications.
• High I/O count in a compact package: 432 I/Os in a 1152-BBGA FCBGA package enables high connectivity without excessive board area.
• Industrial-grade temperature range: −40°C to 100°C operation supports deployment in challenging environments.
• Low-voltage core operation: 820 mV to 880 mV supply range aligns with modern low-voltage system designs.
• Regulatory compliance: RoHS compliant to support environmental and supply-chain requirements.

Why Choose 5SGSMD3H2F35I3WN?

The 5SGSMD3H2F35I3WN positions itself as a high-density Stratix V GS FPGA option for teams that need extensive logic resources, on-chip memory, and a large number of I/Os in a compact surface-mount FCBGA package. Its industrial temperature rating and low-voltage core range make it suitable for robust embedded applications where integration and reliability are priorities.

Designed within the Intel Stratix V family, this device benefits from established product documentation and technical resources. It is appropriate for design teams aiming to consolidate functionality, reduce external component count, and maintain a clear upgrade path within the Stratix V portfolio.

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