5SGSMD3H2F35I3LG

The 5SGSMD3H2F35I3LG is a Stratix V GS field programmable gate array (FPGA) in a 1152‑BBGA FCBGA package designed for industrial applications. It provides a large programmable fabric with substantial embedded memory and a broad I/O complement for designs that require high integration and flexible system interfaces.

This device integrates 236,000 logic elements and approximately 13.3 Mbits of on‑chip RAM, supporting complex logic and data buffering while operating across an industrial temperature range.

Key Features

• Logic Capacity  236,000 logic elements to implement substantial programmable logic and complex state machines.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM to support large FIFOs, buffers, and on‑chip data storage.
• I/O Resources  432 general‑purpose I/O pins for flexible interface options and high pin‑count system integration.
• Power Supply  Core supply range of 820 mV to 880 mV to match system power domains and enable defined power planning.
• Package & Mounting  1152‑BBGA (supplier package: 1152‑FBGA, 35×35 mm) in a surface‑mount form factor for high‑density board designs.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Implement motion control, real‑time processing, and machine automation logic using the device’s large logic capacity and industrial temperature range.
• Communications & Networking  Use the extensive I/O and on‑chip memory for packet buffering, protocol handling, and interface bridging in network infrastructure equipment.
• Data Processing & Acceleration  Deploy parallel data paths and on‑chip buffering for compute‑accelerated tasks that benefit from dense programmable logic.
• Prototyping & System Integration  Leverage the device’s broad I/O and memory resources to prototype complex SoC functions and integrate multiple peripherals on a single FPGA.

Unique Advantages

• High logic density: 236,000 logic elements enable consolidation of multiple functions into a single device, reducing board count and system complexity.
• Substantial embedded memory: Approximately 13.3 Mbits of on‑chip RAM supports large buffers and state storage without immediate external memory dependency.
• Generous I/O complement: 432 I/Os provide flexibility for multiple interfaces, sensors, and high‑pin‑count peripherals.
• Industrial suitability: Rated for −40 °C to 100 °C operation, appropriate for harsh industrial environments where extended temperature range is required.
• Compact, high‑density package: 1152‑BBGA FCBGA in a 35×35 mm supplier package supports dense PCB layouts while remaining surface‑mount compatible.
• Regulatory alignment: RoHS compliance supports contemporary manufacturing and environmental requirements.

Why Choose 5SGSMD3H2F35I3LG?

The 5SGSMD3H2F35I3LG positions itself as a highly integrated FPGA option for industrial designs that require large programmable logic capacity, significant on‑chip memory, and a wide I/O set. Its industrial temperature rating and surface‑mount 1152‑BBGA package make it suitable for compact, robust systems where board space and environmental resilience matter.

Designers targeting consolidated system architectures, high‑density logic implementations, or applications that demand on‑chip buffering and broad I/O flexibility will find this Stratix V GS device aligned with those needs while maintaining RoHS compliance for manufacturing.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical support for integrating the 5SGSMD3H2F35I3LG into your next design.