5SGSMD3H3F35I4WN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 666 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H3F35I4WN – Stratix® V GS FPGA, 236,000 logic elements, 432 I/O (Industrial)

The 5SGSMD3H3F35I4WN is a Stratix® V GS field programmable gate array (FPGA) IC optimized for high-density programmable logic applications. It combines a large logic fabric with significant on-chip memory and extensive I/O capacity to support complex, resource-intensive designs.

Targeted at industrial-temperature designs, this device delivers a balanced platform for applications that require substantial embedded memory, high I/O count, and low-voltage core operation.

Key Features

  • Core Logic  Provides 236,000 logic elements suitable for large-scale FPGA implementations and complex digital logic integration.
  • Embedded Memory  Includes approximately 13.3 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage for high-throughput designs.
  • I/O Capacity  Features 432 I/O pins to interface with a broad range of peripherals, sensors, and high-speed lanes within compact system architectures.
  • Power  Core supply range is 820 mV to 880 mV, enabling low-voltage operation consistent with modern FPGA power domains.
  • Package & Mounting  Offered in a 1152-BBGA FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type supports standard PCB assembly processes.
  • Temperature & Grade  Rated for industrial operation with an operating temperature range of –40°C to 100°C for deployment in demanding thermal environments.
  • Environmental Compliance  RoHS compliant, helping meet regulatory requirements for lead-free assemblies.

Typical Applications

  • Networking & Communications  Large logic capacity and on-chip memory make this device suitable for packet processing, data path offload, and protocol implementation where flexible, high-density logic is required.
  • High-density Compute & Acceleration  Use as a hardware acceleration engine for compute-intensive tasks that benefit from parallel logic and embedded RAM resources.
  • Industrial Control & Automation  Industrial temperature grade and robust I/O count support complex control, monitoring, and data aggregation functions in industrial systems.
  • Custom Hardware & Prototyping  A flexible platform for developing and validating custom digital blocks, system controllers, and peripheral bridges with ample logic and memory resources.

Unique Advantages

  • High logic density: 236,000 logic elements provide the capacity to integrate large, multi-function designs on a single FPGA.
  • Substantial embedded memory: Approximately 13.3 Mbits of on-chip RAM reduces external memory dependence and accelerates local data handling.
  • Extensive I/O: 432 I/O pins enable broad connectivity to system peripherals and high-pin-count interfaces without external multiplexing.
  • Industrial temperature rating: –40°C to 100°C operation enables deployment in temperature-challenging environments.
  • Low-voltage core operation: 820–880 mV supply supports modern low-voltage FPGA power architectures.
  • RoHS compliant package: Meets lead-free assembly requirements for environmentally conscious designs.

Why Choose 5SGSMD3H3F35I4WN?

This Stratix V GS FPGA combines large-scale logic, significant embedded memory, and a high I/O count in an industrial-grade package, offering a robust platform for designers building complex digital systems. Its low-voltage core operation and surface-mount FCBGA packaging support modern board-level integration while maintaining environmental compliance.

Choose the 5SGSMD3H3F35I4WN when your design requires high logic density, plentiful on-chip RAM, and extensive I/O in an FPGA that is qualified for industrial-temperature operation and standard surface-mount assembly.

Request a quote or submit an inquiry to get pricing, availability, and technical support for the 5SGSMD3H3F35I4WN. Our team can help confirm suitability for your specific design and provide ordering information.

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