5SGSMD4E1H29C1WN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA |
|---|---|
| Quantity | 24 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4E1H29C1WN – Stratix® V GS FPGA IC, 360,000 Logic Elements, 780-BBGA (FCBGA)
The 5SGSMD4E1H29C1WN is an Intel Stratix V GS field-programmable gate array (FPGA) IC offering very high logic capacity and embedded memory in a 780-ball BGA package. It delivers a combination of large programmable logic resources, substantial on-chip RAM, and a high I/O count for demanding digital designs.
Designed for commercial applications, this Stratix V GS device targets systems that require extensive custom logic, abundant embedded memory, and flexible I/O — enabling integration of complex functions while minimizing external components. The part is specified for a 0 °C to 85 °C operating range and is RoHS compliant.
Key Features
- Core capacity 360,000 logic elements (logic cells) to implement large-scale custom logic and complex algorithms.
- Embedded memory Approximately 19.456 Mbits of on-chip RAM (19,456,000 bits) for data buffering, FIFOs, and local storage.
- I/O count 360 user I/O pins to support multi-channel interfaces and high pin-count designs.
- Package & mounting 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type for board-level assembly.
- Power supply Core voltage supply range specified from 870 mV to 930 mV.
- Operating conditions Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- High-density custom logic Implement large, application-specific state machines and datapaths using 360,000 logic elements and substantial embedded RAM.
- Digital signal processing On-chip memory and logic resources support complex DSP chains, algorithm acceleration, and real-time processing.
- Multi-protocol interface bridging High I/O count enables aggregation and routing of multiple interfaces or channels within a single FPGA package.
- Compute offload and hardware acceleration Large logic and memory resources make the device suitable for offloading compute-intensive tasks from general-purpose processors.
Unique Advantages
- Large integrated logic resource: 360,000 logic elements reduce reliance on external ASICs and discrete logic, simplifying system architecture.
- Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM enables local buffering and low-latency data handling without external SDRAM for many use cases.
- High I/O density: 360 I/Os provide flexibility for multi-channel designs and dense interface requirements.
- Industry-standard BGA package: 780-BBGA (33×33) surface-mount package balances pin count and PCB routing considerations for compact board layouts.
- Controlled power envelope: Defined supply range (870 mV–930 mV) supports predictable power budgeting and system-level power design.
- Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic applications.
Why Choose 5SGSMD4E1H29C1WN?
The 5SGSMD4E1H29C1WN positions itself as a high-capacity Stratix V GS FPGA aimed at engineers who need extensive programmable logic, ample embedded memory, and a substantial I/O complement in a single, surface-mount BGA package. Its specifications make it well suited for complex digital systems that benefit from on-chip integration and reduced external BOM.
As part of the Stratix V family, this device is documented within the broader device series information, enabling designers to leverage family-level electrical and timing guidance while addressing demanding commercial applications that require scalability and deterministic hardware resources.
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