5SGSMD4E1H29C2LG

The 5SGSMD4E1H29C2LG is an Intel Stratix V GS Field Programmable Gate Array (FPGA) offered in a high-density 780-BBGA FCBGA package. This commercial-grade device provides a large logic fabric, substantial embedded RAM, and a high I/O count for complex digital designs that require on-chip memory and extensive system interfacing.

With surface-mount assembly, RoHS compliance, and a defined commercial operating range, this Stratix V GS device suits production designs that prioritize density, integration, and predictable thermal and power envelopes.

Key Features

• Core logic density — 360,000 logic elements to implement large combinational and sequential designs.
• Embedded memory — Approximately 19.456 Mbits of embedded RAM for on-chip buffering, state storage, and memory-intensive algorithms.
• I/O capacity — 360 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & mounting — 780-BBGA, FCBGA package (supplier device package: 780-HBGA, 33×33) with surface-mount compatibility for compact board integration.
• Power — Core supply range specified at 820 mV to 880 mV to match low-voltage FPGA core domains.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation, aligning with commercial-environment deployments.
• Regulatory — RoHS compliant for environmental and manufacturing conformity.

Typical Applications

• Custom logic acceleration — Implement hardware accelerators and specialized datapaths using the device’s large logic array and on-chip RAM.
• Prototype and system integration — High I/O count and dense logic make the device suitable for consolidating multiple functions during prototyping and system development.
• Memory‑intensive algorithms — Embedded RAM supports designs that require on-chip buffering, lookup tables, and state machines.

Unique Advantages

• High-density implementation: 360,000 logic elements enable complex designs without excessive board-level partitioning.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for many workloads.
• Extensive I/O capability: 360 I/Os simplify integration with peripherals, interfaces, and parallel buses.
• Compact, production-ready package: 780-BBGA (33×33) FCBGA packaging supports dense PCB layouts and surface-mount assembly processes.
• Low-voltage core operation: 820–880 mV supply range aligns with modern low-voltage FPGA core domains for efficient power distribution.
• Commercial-grade consistency: Specified 0 °C to 85 °C operating range and RoHS compliance support standard commercial deployments.

Why Choose 5SGSMD4E1H29C2LG?

The 5SGSMD4E1H29C2LG delivers a balance of high logic capacity, substantial embedded RAM, and broad I/O density in a compact surface-mount BGA package. It is positioned for commercial designs that require consolidated functionality on a single FPGA, predictable operating conditions, and adherence to RoHS requirements.

This device is well suited to engineering teams building dense, memory-aware digital systems that need large on-chip resources and flexible interfacing without moving into industrial temperature grades.

Request a quote or submit an inquiry to receive pricing, lead-time, and integration support for the 5SGSMD4E1H29C2LG. Our team can assist with availability and supply options tailored to your project requirements.