5SGSMD4E1H29I2G

The 5SGSMD4E1H29I2G is an Intel Stratix V GS family FPGA offered in a 780-ball BGA package. It delivers high logic density and substantial on-chip memory in an industrial temperature–grade device intended for demanding embedded and system-level designs.

This device targets designs that require large logic capacity, extensive I/O, and on-chip RAM while operating across a wide industrial temperature range. Key attributes include 360,000 logic elements, approximately 19.46 Mbits of embedded memory, and 360 user I/O pins in a surface-mount 780-BBGA/FCBGA package.

Key Features

• Core Logic Capacity  360,000 logic elements (cells) for implementing complex digital functions and large-scale FPGA designs.
• Logic Array Blocks  135,840 logic array blocks to support hierarchical and high-density logic partitioning.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to store data, buffers, and intermediate state close to logic.
• I/O Count  360 user I/O pins to interface with peripherals, memory, and external logic in dense system designs.
• Power Supply Range  Core voltage supply specified from 870 mV to 930 mV to match system power design requirements.
• Package & Mounting  Surface-mount 780-ball BBGA/FCBGA package (supplier device package: 780-HBGA, 33×33 mm) for high-density board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environmental demands.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Industrial Control Systems  Use the device’s industrial temperature rating, high logic count, and abundant I/O for control, motion, and automation systems.
• High-density Embedded Processing  Deploy the large logic and on-chip RAM resources for embedded compute, data buffering, and custom hardware accelerators.
• Communication & Networking Equipment  Leverage the extensive I/O and logic capacity to implement protocol handling, packet processing, and interface bridging.

Unique Advantages

• High Logic Density: 360,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial On-chip Memory: Approximately 19.46 Mbits of embedded RAM provides local storage for buffering and state without external memory dependence.
• Robust I/O Count: 360 user I/O pins support complex interfacing and multiple parallel connections to external devices and subsystems.
• Industrial-grade Operation: Rated from −40 °C to 100 °C for reliable operation in harsh or outdoor industrial environments.
• Compact, High-density Package: 780-ball BGA (33×33 mm footprint) enables dense PCB routing and surface-mount assembly for compact systems.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose 5SGSMD4E1H29I2G?

This Stratix V GS FPGA balances large-scale logic capacity, significant embedded memory, and extensive I/O in an industrial-grade, surface-mount BGA package. It is suited for engineers and system architects who need a single, high-density programmable device to consolidate functions, reduce BOM count, and support robust operation across industrial temperature ranges.

With clearly specified supply range and packaging details, the 5SGSMD4E1H29I2G offers a verifiable foundation for designs that demand deterministic hardware resources, scalable logic integration, and compliance with RoHS requirements.

Request a quote or submit an inquiry to get pricing and availability for the 5SGSMD4E1H29I2G and to discuss how this Stratix V GS FPGA can fit your next design.