5SGSMD4E1H29I2N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA |
|---|---|
| Quantity | 152 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4E1H29I2N – Stratix® V GS FPGA, 360,000 logic elements, 780‑BBGA (FCBGA)
The 5SGSMD4E1H29I2N is a Stratix V GS field‑programmable gate array (FPGA) implemented in a 28‑nm process with a GS device feature set. It combines high logic capacity with abundant DSP resources and integrated transceivers to address transceiver‑based, DSP‑centric, and data‑intensive applications.
With a 780‑ball BGA package and industrial temperature rating, this surface‑mount device provides a compact, production‑ready platform for designs that require large logic capacity, significant on‑chip memory, and a broad I/O count.
Key Features
- Core / Logic — 360,000 logic elements providing substantial programmable fabric for complex logic, control, and datapath implementations.
- Embedded Memory — Approximately 19.5 Mbits of on‑chip RAM (19,456,000 bits) using M20K memory blocks for large buffer and storage requirements.
- DSP Resources — Stratix V GS family includes variable‑precision DSP blocks suitable for high‑precision signal processing and multiply‑accumulate workloads.
- Transceivers — GS variant supports integrated transceivers with up to 14.1 Gbps data rate capability for backplane and optical interface applications.
- I/O and Packaging — 360 user I/Os in a 780‑BBGA FCBGA package (supplier package 780‑HBGA, 33×33 mm) in a surface‑mount form factor.
- Power — Core supply specified at 0.87–0.93 V to match system power‑rail planning and voltage sequencing.
- Clocking and IP — Fabric includes fractional PLLs and an Embedded HardCopy Block to support hardened IP instantiation (for example, PCIe Gen3/Gen2/Gen1 hardening as provided by the family).
- Operating Range & Compliance — Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance for production deployment.
Typical Applications
- High‑performance DSP systems — Variable‑precision DSP blocks and large embedded memory enable filtering, FFTs, and real‑time signal processing tasks.
- Optical and backplane interfaces — Integrated 14.1 Gbps transceivers support high‑speed serial links for 40G/100G network and transport applications.
- Network packet processing and traffic management — Large logic capacity and abundant on‑chip RAM allow implementation of complex packet engines and buffering.
- Broadcast and military communications — Industrial temperature rating and robust I/O count suit demanding environments and transceiver‑based communication designs.
Unique Advantages
- High logic capacity: 360,000 logic elements enable integration of large, multi‑function systems on a single device, reducing board count and BOM complexity.
- Substantial on‑chip memory: Approximately 19.5 Mbits of embedded RAM supports deep buffering and local data storage without external memory dependence.
- DSP‑focused architecture: Variable‑precision DSP blocks tailored for multiply‑accumulate workloads accelerate signal processing algorithms.
- Integrated high‑speed I/O: 360 user I/Os and GS‑class transceivers at up to 14.1 Gbps simplify integration of high‑bandwidth links and interfaces.
- Industrial reliability: −40 °C to 100 °C operating range and surface‑mount 780‑BBGA packaging support deployment in industrial applications.
- Production continuity: Stratix V family features such as the Embedded HardCopy Block provide a defined path for hardening IP and easing migration to ASIC implementations.
Why Choose 5SGSMD4E1H29I2N?
The 5SGSMD4E1H29I2N positions itself as a high‑capacity, DSP‑oriented Stratix V GS FPGA for designs that require large programmable logic, significant on‑chip memory, and high‑speed serial interfaces. Its industrial temperature rating, comprehensive fabric clocking, and on‑device hardening options make it suitable for production systems in communications, networking, broadcast, and computing.
This device is appropriate for engineers seeking a scalable, production‑ready FPGA platform that aligns logic density, memory resources, and transceiver performance within a single 780‑ball BGA package.
Request a quote or submit a procurement inquiry to obtain pricing, lead times, and availability for the 5SGSMD4E1H29I2N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018