5SGSMD4E2H29C1G

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 775 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E2H29C1G – Stratix® V GS FPGA – 360,000 logic elements, ~19.456 Mbits RAM, 360 I/Os, 780-BBGA

The 5SGSMD4E2H29C1G is a Stratix® V GS field programmable gate array (FPGA) packaged in a 780-ball BGA (FCBGA) designed for surface-mount assembly. It provides a high logic capacity with 360,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 360 I/Os, making it suited to dense, complex digital designs within commercial temperature environments.

This device operates with a core supply voltage range of 870 mV to 930 mV and is specified for commercial-grade operation from 0 °C to 85 °C. The part is RoHS compliant and supplied in a 780-HBGA (33 × 33 mm) package variant.

Key Features

  • Core Logic 360,000 logic elements for implementing large-scale digital designs and complex FPGA architectures.
  • Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and data-path acceleration without external memory.
  • I/O Capacity 360 user I/O pins to enable extensive external interfacing and high pin-count connectivity.
  • Power Core supply voltage range from 870 mV to 930 mV for defined power and performance operation.
  • Package and Mounting 780-BBGA (FCBGA) surface-mount package; supplier device package specified as 780-HBGA (33 × 33 mm) for dense board integration.
  • Temperature Grade Commercial grade operation from 0 °C to 85 °C for standard industrial and commercial applications.
  • Environmental Compliance RoHS compliant to support regulatory and environmental requirements.

Unique Advantages

  • High logic density: With 360,000 logic elements, the device supports complex logic functions and large-scale designs without subdividing across multiple devices.
  • Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependency on external memory for buffering and embedded data structures.
  • Extensive I/O availability: 360 I/Os offer designers flexibility to connect multiple peripherals, interfaces, and high-pin-count systems directly to the FPGA.
  • Compact BGA packaging: The 780-ball FCBGA (33 × 33 mm) package delivers dense integration while remaining compatible with surface-mount assembly processes.
  • Commercial operating range: Specified for 0 °C to 85 °C operation, suitable for a wide range of commercial applications.
  • Regulatory readiness: RoHS compliance supports environmentally conscious product development and market acceptance.

Why Choose 5SGSMD4E2H29C1G?

The 5SGSMD4E2H29C1G combines substantial logic capacity, significant embedded RAM, and a high I/O count in a single surface-mount FCBGA package. Its specifications make it appropriate for teams seeking a commercial-grade FPGA capable of consolidating complex digital functions and on-chip memory resources into a compact footprint.

Engineers and procurement teams will find this Stratix® V GS device valuable for designs that require large-scale logic integration, abundant internal memory, and broad external connectivity while maintaining RoHS compliance and standard commercial temperature operation.

To request a quote or submit an inquiry for 5SGSMD4E2H29C1G, please reach out with your quantity and project requirements and our team will respond with pricing and availability information.

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