5SGSMD4E2H29C1WN

The 5SGSMD4E2H29C1WN is a Stratix® V GS field programmable gate array (FPGA) in a 780‑ball BGA (FCBGA) package. It provides a high-density programmable logic fabric with a large on-chip memory pool and a substantial I/O count for complex digital designs.

Designed for commercial applications, this device combines approximately 360,000 logic elements, approximately 19.456 Mbits of embedded memory, and 360 user I/Os in a surface-mount 780‑HBGA (33 × 33) package, offering a compact platform for high‑density programmable implementations.

Key Features

• Logic Capacity  Approximately 360,000 logic elements for implementing large-scale custom logic and state machines.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and data storage close to logic.
• I/O Density  360 user I/Os to support wide parallel interfaces and multi-domain connectivity.
• Power Supply  Core voltage range specified at 870 mV to 930 mV to match system power delivery requirements.
• Package & Mounting  780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33); surface-mount mounting for PCB assembly.
• Commercial Temperature Grade  Operating temperature range 0 °C to 85 °C suitable for commercial-grade applications.
• RoHS Compliant  Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

• Custom Logic and Prototyping  Implement and validate complex digital designs that require large logic capacity and on-chip memory.
• Data Buffering and Packet Processing  Use the embedded memory and high I/O count to implement buffering, packet queues, and parallel data paths.
• Interface Aggregation  Aggregate and route multiple parallel interfaces or wide buses using the extensive I/O resources.

Unique Advantages

• High Logic Density:  Approximately 360,000 logic elements enable integration of large, complex functions into a single device, reducing board-level component count.
• Significant On‑Chip Memory:  Approximately 19.456 Mbits of embedded RAM supports large buffering and localized data storage to improve throughput and reduce external memory dependence.
• Extensive I/O Resources:  360 I/Os provide flexibility for wide buses, multiple peripherals, and high‑pin-count interfacing without external multiplexing.
• Compact Surface‑Mount Package:  780‑HBGA (33×33) package offers a high pin density in a compact footprint for space-conscious PCB designs.
• Commercial‑Grade Operating Range:  0 °C to 85 °C rating matches standard commercial deployment environments and testing regimes.
• Regulatory Compliance:  RoHS compliance supports lead‑free manufacturing and global environmental requirements.

Why Choose 5SGSMD4E2H29C1WN?

This Stratix® V GS device brings together large logic resources, substantial embedded memory, and a high I/O count in a compact 780‑ball BGA package—making it well suited for commercial projects that require dense programmable logic and on‑chip data storage. The specified core voltage range and commercial temperature rating provide clear electrical and environmental targets for system design.

Choose 5SGSMD4E2H29C1WN for designs that demand high integration in a surface‑mount, RoHS‑compliant FPGA package, where reducing board complexity and consolidating functionality onto a single programmable device are priorities.

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