5SGSMD4E2H29C2LN

The 5SGSMD4E2H29C2LN is an Intel Stratix® V GS field-programmable gate array supplied in a 780-ball FCBGA package. Built on the Stratix V family architecture, this device targets high-performance DSP and transceiver-based designs that require large logic capacity, significant on-chip memory, and extensive I/O.

Key value propositions include a high logic element count, approximately 19.456 Mbits of embedded RAM, and a dense 360‑pin I/O footprint, making the device suitable for data‑intensive signal processing, packet processing, and communications applications within commercial temperature ranges.

Key Features

• Core Architecture Stratix V family architecture with a 28‑nm class device core; optimized for high-performance programmable logic and DSP-centric implementations.
• Logic Capacity 360,000 logic elements to implement large, complex designs and multi‑function systems on a single device.
• Embedded Memory Approximately 19.456 Mbits of on‑chip RAM, organized into high-density memory blocks for buffering, FIFOs, and large data structures.
• DSP and Hard IP (Family Capability) Stratix V GS family devices include abundant variable‑precision DSP resources (family data indicates support for up to 3,926 18×18 or 1,963 27×27 multipliers) and integrated hard IP blocks for protocol and data‑plane acceleration.
• I/O 360 general-purpose I/Os to support broad interfacing needs and high pin‑count system connections.
• Power and Voltage Specified core supply voltage range of 820 mV to 880 mV for platform power planning and thermal budgeting.
• Package and Mounting 780‑ball BGA (FCBGA) package; supplier package listed as 780‑HBGA (33×33), surface‑mount compatible for modern PCB assembly processes.
• Operating Conditions Commercial grade operation from 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• High‑Performance DSP Systems Implement large, variable‑precision filtering, FFTs, and custom arithmetic using the family’s extensive DSP resources and on‑chip memory.
• Network and Packet Processing Use the dense logic and 360 I/Os to handle complex packet pipelines, classification, and buffering in communication equipment.
• Optical and Backplane Interfaces Leverage the Stratix V GS family’s transceiver and interface capabilities for high‑bandwidth backplane and optical front‑end processing (family-level transceiver support noted in datasheet).
• Compute‑Accelerator Modules Deploy as a programmable accelerator where large logic capacity and embedded RAM accelerate custom algorithms and dataflows.

Unique Advantages

• Large Logic Integration: 360,000 logic elements reduce the need for multi‑chip solutions and simplify board-level design.
• Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM supports deep buffering and large state machines without external memory.
• DSP‑Oriented Family Features: Family DSP multiplier counts and variable‑precision blocks enable high‑throughput, precision‑tunable signal processing implementations.
• High I/O Count: 360 I/Os accommodate wide parallel interfaces and multiple peripheral lanes for flexible system integration.
• Commercial‑Grade Deployment: Operates across a 0 °C to 85 °C range and is RoHS compliant for standard commercial applications.
• Compact, Assembly‑Ready Package: 780‑ball FCBGA (33×33) surface‑mount package supports dense board layouts and standard SMT assembly flows.

Why Choose 5SGSMD4E2H29C2LN?

The 5SGSMD4E2H29C2LN offers a balance of high logic density, significant embedded memory, and extensive I/O in a commercial‑grade Stratix V GS device. It is suited to engineers building DSP‑heavy, transceiver‑enabled, or data‑intensive systems that require on‑chip resources to minimize external components and accelerate development.

Choosing this FPGA enables scalable designs that leverage the Stratix V family’s DSP and hard IP capabilities while maintaining predictable power and thermal profiles via the specified core voltage range. The device provides a long‑term platform for complex algorithm acceleration, interface consolidation, and high‑throughput data handling.

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