5SGSMD4E2H29C3G

The 5SGSMD4E2H29C3G is a Stratix® V GS Field Programmable Gate Array (FPGA) offered in a 780-BBGA FCBGA package. It provides a high logic density fabric with substantial embedded memory and a large I/O count for complex, board-level digital designs.

Designed for commercial temperature operation, this device delivers up to 360,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 360 user I/O, while operating from a core supply range of 820 mV to 880 mV. Detailed electrical and switching characteristics are documented in the Stratix V device datasheet.

Key Features

• Core Logic Capacity — 360,000 logic elements to implement large-scale custom logic, state machines, and datapath-intensive designs.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, large FIFOs, and memory-intensive algorithms.
• I/O Resources — 360 user I/O pins to support broad external interfacing and multi-channel connectivity.
• Power — Core voltage supply range from 820 mV to 880 mV to match system power rails and enable predictable power budgeting.
• Package & Mounting — 780-BBGA, FCBGA package (supplier device package: 780-HBGA, 33×33) with surface-mount mounting type for compact, high-density board integration.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C for standard embedded and enterprise applications.
• Regulatory — RoHS compliant for environmental and assembly compatibility.

Typical Applications

• High-density digital systems — Implement complex control logic and large combinational/sequential designs using the device’s 360,000 logic elements and abundant on-chip RAM.
• Multi-interface controllers — Use the 360 user I/O pins to consolidate multiple peripheral and bus interfaces on a single FPGA.
• Custom acceleration and prototyping — Leverage the large logic and memory resources to prototype hardware accelerators or offload compute tasks in embedded platforms.
• Board-level system integration — The 780-BBGA package and surface-mount mounting suit compact PCB layouts requiring high integration density.

Unique Advantages

• High logic density: 360,000 logic elements enable integration of wide datapaths and large finite-state machines without additional external logic.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory minimizes reliance on external memory for buffering and local storage.
• Extensive I/O: 360 I/O pins provide flexibility to connect multiple peripherals, buses, and external devices directly to the FPGA fabric.
• Compact packaging: 780-BBGA (33×33) surface-mount package supports high-density PCBs while maintaining robust signal routing options.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet standard embedded and enterprise environmental requirements.
• RoHS compliant: Meets common environmental and assembly requirements for modern electronics production.

Why Choose 5SGSMD4E2H29C3G?

The 5SGSMD4E2H29C3G positions itself as a high-capacity Stratix V GS FPGA tailored for designs that demand significant logic resources, on-chip memory, and a large number of I/O signals within a compact BGA footprint. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of embedded and enterprise applications where integration density and predictable electrical characteristics matter.

Engineers and system designers seeking scalable FPGA resources with documented electrical and switching characteristics available in the Stratix V device datasheet can evaluate this device for complex control, interfacing, and acceleration roles where consolidation and performance per board area are priorities.

Request a quote or submit a pricing and availability inquiry to evaluate the 5SGSMD4E2H29C3G for your next design.