5SGSMD4E2H29I2L

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 57 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E2H29I2L – Stratix® V GS FPGA, 360 I/O, 360,000 logic elements

The 5SGSMD4E2H29I2L is an Intel Stratix V GS field-programmable gate array supplied in a 780-BBGA FCBGA package. It combines a high logic element count with abundant DSP resources, on-chip memory, and integrated transceivers to address bandwidth- and signal-processing‑centric designs.

Designed for industrial-grade applications, this device targets data‑intensive and DSP-oriented systems that require dense logic, extensive I/O, and on‑chip memory while operating across a wide industrial temperature range.

Key Features

  • Logic Capacity  360,000 logic elements and 135,840 adaptive logic modules (ALMs) provide high-density programmable fabric for complex designs.
  • Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM (total RAM bits: 19,456,000) delivered via 20-Kbit (M20K) embedded memory blocks to support large buffers and on-chip data storage.
  • DSP Resources  Stratix V GS architecture includes a large array of variable-precision DSP blocks; the family supports high-count multipliers for demanding signal-processing tasks.
  • High‑speed Transceivers  Integrated transceivers with up to 14.1 Gbps capability on GS devices, enabling backplane and optical interface connectivity for high-bandwidth data transport.
  • I/O and Packaging  360 user I/Os in a 780‑BBGA FCBGA package (supplier package: 780‑HBGA, 33×33) for dense routing and board-level integration.
  • Core Supply Range  Core voltage supply range of 820 mV to 880 mV to match system power planning and device requirements.
  • Process and Fabric  Built on a 28‑nm process with Altera/Intel adaptive logic modules (ALMs) and a multi-track routing architecture for predictable timing and routing resources.
  • Industrial Temperature Grade  Specified operating temperature from −40 °C to 100 °C for deployment in industrial environments.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • High‑performance DSP systems  Leverage the device’s abundant DSP blocks and on‑chip memory for signal processing, filtering, and algorithm acceleration.
  • Optical and backplane interfaces  Integrated transceivers support high‑bandwidth serial links for 40G/100G transport and other optical/backplane protocols.
  • Packet processing and network equipment  Dense logic resources and wide I/O count enable complex packet engines, traffic management, and protocol processing.
  • Military, broadcast, and HPC  DSP‑centric architectures and robust thermal range make the device suitable for broadcast processing, high‑performance compute, and defense communications.

Unique Advantages

  • High logic density: 360,000 logic elements and 135,840 ALMs allow consolidation of large designs into a single device, reducing board count and system complexity.
  • Substantial on‑chip memory: Approximately 19.46 Mbits of embedded RAM supports deep buffering and local data storage for latency‑sensitive algorithms.
  • DSP‑oriented architecture: Variable‑precision DSP blocks and numerous multipliers accelerate compute‑intensive signal processing without external accelerators.
  • Integrated high‑speed I/O: 360 I/Os and transceivers capable of 14.1 Gbps data rates enable high‑bandwidth interfaces directly from the FPGA fabric.
  • Industrial robustness: Specified −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments.
  • Packaging for dense designs: 780‑ball BBGA (33×33) package supports high I/O count and compact PCB implementations.

Why Choose 5SGSMD4E2H29I2L?

The 5SGSMD4E2H29I2L Stratix V GS FPGA balances high logic density, extensive DSP resources, and significant on‑chip memory to address demanding, bandwidth‑ and compute‑intensive applications. Its integrated transceiver capability and large I/O complement systems that require high data throughput and complex protocol handling.

This device is well suited for engineering teams building industrial and high‑performance signal‑processing systems that need a single, scalable FPGA solution with industry‑grade operating range and proven Stratix V architecture characteristics.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the 5SGSMD4E2H29I2L.

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