5SGSMD4E2H29I2LN

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 517 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E2H29I2LN – Stratix V GS FPGA (360,000 logic elements, 780-BBGA)

The 5SGSMD4E2H29I2LN is a Stratix® V GS field-programmable gate array designed for DSP-centric, transceiver-based applications. It combines a high logic element count with substantial embedded memory and series-level Stratix V architecture features such as redesigned adaptive logic modules and multi-track routing.

This device targets bandwidth- and compute-intensive markets where large logic capacity, integrated transceivers, and abundant DSP resources accelerate system-level processing and protocol handling while supporting industrial temperature ranges and surface-mount packaging.

Key Features

  • Logic Capacity 360,000 logic elements to implement complex custom logic, large state machines, and wide datapaths.
  • Embedded Memory Approximately 19.456 Mbits of on-chip RAM for FIFOs, buffers, and memory-intensive algorithms.
  • DSP Resources Stratix V GS family includes variable precision DSP blocks optimized for high-performance signal processing; the family supports up to 3,926 18×18 or 1,963 27×27 multipliers (series-level capability).
  • High-speed Transceivers Stratix V GS devices provide integrated transceivers with up to 14.1 Gbps data-rate capability for backplane and optical interfaces (series-level capability).
  • I/O Density 360 user I/O pins to support wide parallel interfaces and multiple high-speed serial channels.
  • Package and Mounting 780-BBGA FCBGA package; supplier device package noted as 780-HBGA (33×33). Surface-mount mounting type.
  • Power Core supply operating between 820 mV and 880 mV for the device core.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C for demanding environments.
  • Fabric and Clocking Series-level Stratix V architecture includes redesigned adaptive logic modules, M20K embedded memory blocks, fractional PLLs, and a comprehensive fabric clocking network.
  • RoHS Compliance Device is RoHS compliant.

Typical Applications

  • High-performance DSP and HPC Use the device’s large logic count and variable-precision DSP blocks for signal-processing pipelines, FFTs, and compute-accelerated workloads.
  • Optical and Packet Networking Integrated transceivers and high I/O density support 40G/100G-class interfaces, backplane links, and packet-processing engines.
  • Broadcast and Military Communications Dense logic and embedded memory enable complex protocol handling, modulation/demodulation, and real-time data processing.
  • Prototyping for ASIC Migration Stratix V devices provide a low-risk prototyping path and a documented migration route to HardCopy® V ASICs for higher-volume production (series-level capability).

Unique Advantages

  • High Logic Density: 360,000 logic elements reduce the need for board-level partitioning and simplify system integration for large designs.
  • Substantial On-chip Memory: Approximately 19.456 Mbits of embedded RAM enables large buffers and on-chip data storage, lowering external memory dependence.
  • DSP and Transceiver Integration: Variable-precision DSP blocks combined with 14.1 Gbps-class transceivers (series-level) consolidate signal-processing and high-speed I/O in one device.
  • Industrial Temperature Rating: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
  • Compact, High-pin-count Package: 780-BBGA FCBGA package with a 33×33 supplier footprint provides high I/O in a compact surface-mount form factor.
  • RoHS Compliance: Environmentally compliant construction for regulated markets and supply chains.

Why Choose 5SGSMD4E2H29I2LN?

This Stratix V GS device balances very large logic capacity, significant on-chip RAM, and series-level DSP and transceiver capabilities to address demanding signal-processing and high-bandwidth system designs. It is suited for engineering teams building networking, communications, and compute-accelerated applications that require integration of dense logic and high-speed I/O within an industrial temperature envelope.

Backed by the Stratix V family architecture and the documented HardCopy® V migration path, the 5SGSMD4E2H29I2LN offers a scalable platform for prototyping through production, delivering long-term design continuity and series-level ecosystem support.

Request a quote or submit an RFQ for 5SGSMD4E2H29I2LN to evaluate suitability for your next high-performance FPGA design.

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