5SGSMD4E2H29I2LN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA |
|---|---|
| Quantity | 517 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4E2H29I2LN – Stratix V GS FPGA (360,000 logic elements, 780-BBGA)
The 5SGSMD4E2H29I2LN is a Stratix® V GS field-programmable gate array designed for DSP-centric, transceiver-based applications. It combines a high logic element count with substantial embedded memory and series-level Stratix V architecture features such as redesigned adaptive logic modules and multi-track routing.
This device targets bandwidth- and compute-intensive markets where large logic capacity, integrated transceivers, and abundant DSP resources accelerate system-level processing and protocol handling while supporting industrial temperature ranges and surface-mount packaging.
Key Features
- Logic Capacity 360,000 logic elements to implement complex custom logic, large state machines, and wide datapaths.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM for FIFOs, buffers, and memory-intensive algorithms.
- DSP Resources Stratix V GS family includes variable precision DSP blocks optimized for high-performance signal processing; the family supports up to 3,926 18×18 or 1,963 27×27 multipliers (series-level capability).
- High-speed Transceivers Stratix V GS devices provide integrated transceivers with up to 14.1 Gbps data-rate capability for backplane and optical interfaces (series-level capability).
- I/O Density 360 user I/O pins to support wide parallel interfaces and multiple high-speed serial channels.
- Package and Mounting 780-BBGA FCBGA package; supplier device package noted as 780-HBGA (33×33). Surface-mount mounting type.
- Power Core supply operating between 820 mV and 880 mV for the device core.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for demanding environments.
- Fabric and Clocking Series-level Stratix V architecture includes redesigned adaptive logic modules, M20K embedded memory blocks, fractional PLLs, and a comprehensive fabric clocking network.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- High-performance DSP and HPC Use the device’s large logic count and variable-precision DSP blocks for signal-processing pipelines, FFTs, and compute-accelerated workloads.
- Optical and Packet Networking Integrated transceivers and high I/O density support 40G/100G-class interfaces, backplane links, and packet-processing engines.
- Broadcast and Military Communications Dense logic and embedded memory enable complex protocol handling, modulation/demodulation, and real-time data processing.
- Prototyping for ASIC Migration Stratix V devices provide a low-risk prototyping path and a documented migration route to HardCopy® V ASICs for higher-volume production (series-level capability).
Unique Advantages
- High Logic Density: 360,000 logic elements reduce the need for board-level partitioning and simplify system integration for large designs.
- Substantial On-chip Memory: Approximately 19.456 Mbits of embedded RAM enables large buffers and on-chip data storage, lowering external memory dependence.
- DSP and Transceiver Integration: Variable-precision DSP blocks combined with 14.1 Gbps-class transceivers (series-level) consolidate signal-processing and high-speed I/O in one device.
- Industrial Temperature Rating: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
- Compact, High-pin-count Package: 780-BBGA FCBGA package with a 33×33 supplier footprint provides high I/O in a compact surface-mount form factor.
- RoHS Compliance: Environmentally compliant construction for regulated markets and supply chains.
Why Choose 5SGSMD4E2H29I2LN?
This Stratix V GS device balances very large logic capacity, significant on-chip RAM, and series-level DSP and transceiver capabilities to address demanding signal-processing and high-bandwidth system designs. It is suited for engineering teams building networking, communications, and compute-accelerated applications that require integration of dense logic and high-speed I/O within an industrial temperature envelope.
Backed by the Stratix V family architecture and the documented HardCopy® V migration path, the 5SGSMD4E2H29I2LN offers a scalable platform for prototyping through production, delivering long-term design continuity and series-level ecosystem support.
Request a quote or submit an RFQ for 5SGSMD4E2H29I2LN to evaluate suitability for your next high-performance FPGA design.

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