5SGSMD4E2H29I3G

The 5SGSMD4E2H29I3G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC offered in a 780-ball BGA (FCBGA) package. It delivers high on-chip logic density and embedded memory capacity in an industrial-grade device intended for demanding system designs.

With 360,000 logic elements, approximately 19.456 Mbits of embedded memory and 360 user I/Os, this device targets applications that require dense logic integration, substantial local RAM, and a large I/O count in a surface-mount BGA footprint.

Key Features

• Core Logic 360,000 logic elements for implementing complex logic, state machines, and custom compute pipelines.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, queueing, and on-chip data storage.
• I/O Density 360 user I/Os to support broad parallel connectivity and flexible board-level interfacing.
• Package 780-BBGA (FCBGA) supplier package noted as 780-HBGA (33×33) for surface-mount PCB assembly.
• Power/Core Voltage Core supply range specified at 820 mV to 880 mV.
• Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Mounting Surface-mount device suitable for standard PCB assembly processes.
• RoHS Compliance Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Industrial Control Implement complex control logic, I/O aggregation, and deterministic state machines for factory and process automation systems.
• Signal Processing Deploy on-chip memory and dense logic to accelerate data-paths, buffering, and preprocessing functions.
• High-Density I/O Systems Use the 360 I/Os to connect to multiple peripherals, sensors, or parallel interfaces where large pin counts are required.
• Prototyping and Algorithm Development Map large custom functions and iterative designs requiring significant logic and embedded RAM resources.

Unique Advantages

• High Logic Capacity: 360,000 logic elements enable large-scale integration of custom digital functions on a single device, reducing board-level complexity.
• Substantial On-Chip RAM: Approximately 19.456 Mbits of embedded memory minimizes dependence on external RAM for many buffering and local storage needs.
• Large I/O Count: 360 I/Os provide flexibility for parallel interfaces and high pin-count system integration without external multiplexing.
• Industrial Temperature Range: Specified operation from –40 °C to 100 °C supports deployment in harsher environmental conditions.
• Compact BGA Packaging: 780-ball FCBGA footprint (33×33 supplier package) balances high pin count with a compact board area for dense system designs.
• Low-Voltage Core: Core supply range of 820–880 mV supports power-optimized designs and modern FPGA power architectures.

Why Choose 5SGSMD4E2H29I3G?

The 5SGSMD4E2H29I3G Stratix V GS FPGA brings together a large logic fabric, significant embedded memory, and abundant I/O in an industrial-grade BGA package. It is suited for engineers and system designers who need to consolidate complex digital functions, local buffering, and broad external interfacing into a single programmable device.

Its combination of capacity, package density, and temperature rating makes it a practical choice for industrial applications, advanced prototyping, and systems where on-chip resources reduce BOM complexity and simplify board-level design. The device benefits from established Stratix V documentation and ecosystem resources for design and integration.

If you would like pricing, lead-time, or a formal quote for the 5SGSMD4E2H29I3G, submit a sales inquiry or request a quote and our team will respond with the information you need.