5SGSMD4E2H29I3N

The 5SGSMD4E2H29I3N is a Stratix V GS family field programmable gate array (FPGA) in a high-density FCBGA package. It provides a large fabric of programmable logic, on-chip memory and I/O suitable for industrial electronic systems that require substantial integration and configurability.

Designed for surface-mount assembly and RoHS compliance, this device targets applications that need a high count of logic elements, abundant embedded RAM, and dense I/O connectivity while operating across an industrial temperature range.

Key Features

• High-density logic — 360,000 logic elements for complex digital designs and large-scale logic integration.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive tasks.
• Generous I/O — 360 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power/Voltage — Rated voltage supply range of 820 mV to 880 mV.
• Package and mounting — 780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33); surface-mount mounting type for modern PCB assembly.
• Industrial temperature range — Specified to operate from –40 °C to 100 °C for deployment in industrial environments.
• Regulatory status — RoHS compliant.

Typical Applications

• Industrial control systems — Use the high logic density and robust operating temperature range for control, automation and process monitoring tasks.
• High-density interface aggregation — Leverage 360 I/O pins to consolidate multiple parallel interfaces or IO-rich subsystems onto a single FPGA.
• Memory-intensive accelerators — Utilize approximately 19.456 Mbits of embedded RAM for buffering, packet processing or intermediate data storage in compute pipelines.

Unique Advantages

• Large programmable fabric: 360,000 logic elements enable integration of complex algorithms and significant on-chip functionality, reducing external component count.
• Substantial embedded RAM: Approximately 19.456 Mbits of on-chip memory supports local data storage and high-throughput buffering without immediate dependence on external memory.
• High I/O capacity: 360 I/O pins provide flexibility for wide buses, multi-channel sensors, and extensive peripheral connectivity.
• Industrial operating range: Rated for –40 °C to 100 °C, suitable for demanding temperature environments common in industrial applications.
• FCBGA surface-mount package: 780-ball BGA (780-HBGA 33×33 supplier package) supports compact board designs and automated assembly processes.
• Regulatory compliance: RoHS compliance helps meet environmental and supply-chain requirements.

Why Choose 5SGSMD4E2H29I3N?

The 5SGSMD4E2H29I3N balances very high logic capacity, significant embedded memory, and broad I/O in a single industrial-grade FCBGA package. It is well suited for engineers and system designers who need to consolidate complex digital functions and memory-intensive tasks into one programmable device while maintaining operation across a wide temperature range.

Its combination of high integration, surface-mount packaging and RoHS compliance makes it a practical choice for industrial applications and designs that require long-term scalability and reliable operation.

Request a quote or submit an inquiry to obtain pricing, availability and to discuss how 5SGSMD4E2H29I3N can meet your project requirements.