5SGSMD4E3H29C2G

The 5SGSMD4E3H29C2G is a Stratix V GS field programmable gate array (FPGA) offered in a commercial temperature grade. It delivers a high-density programmable fabric with substantial embedded memory and a large number of I/O pins, packaged in a 780-BBGA FCBGA form factor.

This device is intended for designers requiring significant on-chip logic capacity, abundant I/O, and integrated RAM for complex digital systems where commercial temperature operation and surface-mount package compatibility are required.

Key Features

• Logic Capacity  Approximately 360,000 logic elements suitable for large-scale, high-complexity designs.
• Embedded Memory  Approximately 19.456 Mbits of total on-chip RAM to support data buffering, scratchpad storage, and memory-intensive algorithms.
• I/O Resources  360 programmable I/O pins to support wide bus interfaces, parallel peripherals, and multi-channel I/O systems.
• Power Rail  Core voltage supply range of 870 mV to 930 mV for the device core power domain.
• Package & Mounting  780-BBGA, FCBGA package (supplier device package: 780-HBGA (33×33)); surface-mount mounting type for standard PCB assembly.
• Operating Conditions  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Leverage the ~360,000 logic elements and ~19.456 Mbits of embedded memory to implement complex packet processing, algorithm acceleration, or custom compute blocks.
• Multi‑channel I/O systems  Use the 360 I/O pins for wide parallel data paths, multiport interfaces, and custom protocol bridging.
• Prototyping and system integration  Suitable for FPGA-based prototyping and integration into commercial-temperature designs where a high logic count and compact BGA package are required.

Unique Advantages

• High logic density: The large logic-element count enables implementation of complex, feature-rich designs without external logic expansion.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces reliance on external memory for many buffering and storage needs, simplifying system design.
• Extensive I/O capability: 360 I/O pins provide flexibility for parallel interfaces and multiple peripherals, minimizing the need for external interface components.
• Compact BGA package: 780-BBGA / 780-HBGA (33×33) packaging supports high pin density in a surface-mount form factor for modern PCB layouts.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial deployment environments.
• RoHS compliant: Conforms to RoHS requirements for environmentally responsible designs.

Why Choose 5SGSMD4E3H29C2G?

The 5SGSMD4E3H29C2G positions itself as a high-capacity, commercially rated Stratix V GS FPGA well suited to designers who need abundant logic resources, substantial embedded RAM, and a large I/O complement in a compact BGA package. Its documented operating conditions and core voltage range enable straightforward power planning for commercial systems.

Backed by the Stratix V device documentation, this FPGA is appropriate for teams building complex digital systems, multi‑channel interfaces, or FPGA-based prototypes where integration density and predictable commercial-temperature operation are key criteria.

Request a quote or submit an inquiry to purchase 5SGSMD4E3H29C2G. Refer to the Stratix V device datasheet for detailed electrical characteristics and design guidance.