5SGSMD4E3H29C2LG

The 5SGSMD4E3H29C2LG is a Stratix® V GS field programmable gate array (FPGA) IC from Intel, offered in a 780‑BBGA FCBGA package. This commercial‑grade device provides large on‑chip logic and memory resources for complex digital designs.

Designed for applications that require high logic density and substantial embedded RAM, the device is characterized in Intel's Stratix V device datasheet, which covers electrical and switching characteristics including transceiver and I/O timing information.

Key Features

• Core Capacity  360,000 logic elements for implementing large-scale digital logic and custom hardware functions.
• Logic Array Blocks  135,840 logic array blocks (LABs) to structure and partition logic resources.
• Embedded Memory  Approximately 19.456 Mbits of embedded memory (19,456,000 total RAM bits) for on‑chip buffering, FIFOs, and data storage.
• I/O Resources  360 user I/O pins to support dense board-level interconnect and a variety of peripheral interfaces.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV, enabling defined power provisioning and thermal planning.
• Package  780‑BBGA, FCBGA package; supplier device package listed as 780‑HBGA (33×33) for high pin count and compact board footprint.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS‑compliant.

Typical Applications

• High‑density digital systems  Implement complex finite state machines, datapaths, and custom accelerators using the device’s large logic element count and embedded memory.
• High‑speed I/O and protocol bridging  Leverage the plentiful I/O and Stratix V family transceiver characterization to implement dense I/O fabrics and interface logic.
• Data buffering and on‑chip storage  Use the approximately 19.456 Mbits of embedded RAM for packet buffering, FIFOs, and temporary data storage to reduce external memory dependence.
• Custom compute and signal processing  Map parallel processing blocks and pipeline stages across the large logic resource pool for bespoke acceleration tasks.

Unique Advantages

• Substantial logic density: 360,000 logic elements enable implementation of large, multi‑module designs without immediate partitioning to multiple devices.
• Significant on‑chip RAM: Approximately 19.456 Mbits of embedded memory reduces system BOM by limiting required external DRAM for many buffering and storage needs.
• High pin count packaging: 780‑BBGA (780‑HBGA supplier package, 33×33) supports dense board connectivity while keeping the device footprint manageable.
• Defined power envelope: A narrow core supply range (820 mV–880 mV) simplifies power rail design and margining for stable operation.
• Commercial temperature suitability: Rated for 0 °C to 85 °C for mainstream commercial deployments where this temperature range is appropriate.
• Standards‑based documentation: Characterization and electrical/switching parameters are detailed in the Stratix V device datasheet for predictable integration.

Why Choose 5SGSMD4E3H29C2LG?

The 5SGSMD4E3H29C2LG delivers a balanced combination of large logic resource count, substantial embedded RAM, and a high I/O count in a 780‑BBGA package, making it well suited to commercial designs that demand dense logic integration and on‑chip storage. Its defined core voltage range and documented operating conditions support predictable power and thermal planning.

Engineers targeting complex digital systems, protocol bridging, or custom acceleration can leverage the Stratix V family documentation for electrical and switching characteristics to guide system integration and timing closure.

Request a quote or submit an inquiry for pricing and availability of the 5SGSMD4E3H29C2LG.