5SGSMD4E3H29C2LN

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA

Quantity 1,031 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4E3H29C2LN – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSMD4E3H29C2LN is a Stratix V GS variant FPGA in a 780‑BBGA FCBGA package, offering a high-density, transceiver-enabled fabric designed for DSP-centric and transceiver-based systems. Built on the Stratix V family architecture, this device combines a large logic capacity with substantial on-chip memory and integrated transceivers to address bandwidth- and signal-processing-focused applications.

This commercial‑grade, surface‑mount device supports a core supply range of 820 mV to 880 mV and operates from 0 °C to 85 °C, making it suitable for volume production platforms targeting wireline, broadcast, military communications, and high-performance compute applications that require programmable DSP and transceiver resources.

Key Features

  • Logic Capacity — 360,000 logic elements for dense combinational and sequential logic implementations.
  • Embedded Memory — Approximately 19.5 Mbits of on-chip RAM implemented with M20K embedded memory blocks to support large buffering and state storage.
  • DSP Resources — Abundant variable-precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision, high‑throughput signal processing.
  • Integrated Transceivers — GS devices include integrated transceivers with 14.1 Gbps data‑rate capability for backplane and optical interface applications.
  • I/O and Package — 360 I/O pins in a 780-BBGA (33 × 33) package; surface-mount mounting type suitable for dense board layouts.
  • Process and Core — Stratix V family device architecture based on 28‑nm process technology with 0.85 V/0.9 V class core voltages; this part specifies a 820–880 mV supply range.
  • Embedded HardCopy Block — Supports Embedded HardCopy Block for hardened IP instantiation, including PCIe Gen1/Gen2/Gen3 hardening options described for the family.
  • Commercial Grade & RoHS — Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

  • Wireline and Optical Transport — Implements transceiver and DSP functions for 40G/100G class optical systems, backplane interfaces, and packet processing.
  • Broadcast and High‑Performance Video — High DSP multiplier counts and large embedded RAM support demanding video processing and format conversion tasks.
  • Military Communications — Programmable DSP and transceiver resources enable high‑performance signal processing and protocol interfacing in communication systems.
  • High‑Performance Computing (HPC) — Dense logic and DSP resources make the device suitable for accelerator front-ends and data‑intensive compute offload functions.

Unique Advantages

  • High Logic Density: 360,000 logic elements provide headroom for complex, large-scale FPGA designs without immediate need for external logic expansion.
  • Substantial On‑Chip Memory: Approximately 19.5 Mbits of embedded RAM reduce dependence on external memory for buffering and state, simplifying system design.
  • Targeted DSP Capability: Thousands of variable-precision multipliers enable efficient implementation of high-precision filtering, transforms, and other signal-processing kernels.
  • Integrated High‑Speed I/O: 14.1 Gbps transceiver capability and 360 I/Os support high-bandwidth interfaces and flexible board-level connectivity.
  • Production‑Oriented Packaging: 780‑BBGA (33 × 33) surface‑mount package supports volume manufacturing and dense PCB integration.
  • Family Hardening Path: Embedded HardCopy Block availability in the Stratix V family provides a path to hardened IP implementations for PCIe and other interfaces.

Why Choose 5SGSMD4E3H29C2LN?

The 5SGSMD4E3H29C2LN combines a large logic fabric, considerable on‑chip RAM, extensive DSP multipliers, and integrated 14.1 Gbps transceivers in a production-ready 780‑BBGA package. It is positioned for engineers and system designers building transceiver- and DSP-centric platforms where programmable performance, memory bandwidth, and interface density are key requirements.

With commercial grade temperature range, a clearly defined core supply window (820–880 mV), and RoHS compliance, this Stratix V GS device fits into volume production designs that need scalability and access to the Stratix V device family features and hardening options.

Request a quote or submit an inquiry to get pricing, availability, and lead-time details for the 5SGSMD4E3H29C2LN.

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