5SGSMD4E3H29C2WN

The 5SGSMD4E3H29C2WN is an Intel Stratix® V GS field programmable gate array (FPGA) supplied in a 780‑BBGA FCBGA package. It delivers high-density programmable logic—360,000 logic elements—and substantial on‑chip memory for demanding digital designs.

Designed for commercial temperature applications, this device combines large logic and memory resources with a high I/O count and low-voltage core operation to address high‑density prototyping, complex system integration, and high‑pin‑count board designs.

Key Features

• Core Logic — 360,000 logic elements to implement large-scale digital logic and complex custom functions.
• Embedded Memory — Approximately 19.46 Mbits of on‑chip RAM for buffering, state storage, and block memory requirements.
• I/O Density — 360 user I/Os to support multiple high‑pin interfaces and board‑level connectivity.
• Power and Voltage — Core supply range specified at 870 mV to 930 mV for low-voltage operation.
• Package & Mounting — 780‑BBGA FCBGA package; supplier device package noted as 780‑HBGA (33 × 33). Surface mount package for compact board designs.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant manufacturing status.
• Family Documentation — Part of the Stratix V family; datasheet covers electrical and switching characteristics including I/O timing and transceiver information for Stratix V devices.

Typical Applications

• FPGA Prototyping and Emulation — Large logic capacity and substantial embedded RAM enable board‑level prototyping and complex hardware emulation.
• High‑Density Digital Processing — Use the abundant logic elements and on‑chip memory for compute‑intensive signal processing and custom accelerators.
• High‑Pin‑Count System Interfaces — 360 I/Os support multi‑channel interfaces, extensive peripheral connectivity, and complex integration on compact PCBs.
• Network and Data Path Functions — Dense logic and memory resources for implementing packet processing, buffering, and control plane functions within commercial systems.

Unique Advantages

• High integration density: 360,000 logic elements and ~19.46 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board area.
• High I/O capability: 360 user I/Os enable rich system interfacing and support for multiple parallel buses or channels.
• Low‑voltage core: Specified core supply range (870–930 mV) supports modern, power‑efficient system designs.
• Commercial temperature readiness: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• RoHS compliance: Environmentally compliant manufacturing and assembly.
• Package flexibility: 780‑BBGA FCBGA with supplier package reference (780‑HBGA, 33 × 33) for high‑pin, compact board implementations.

Why Choose 5SGSMD4E3H29C2WN?

The 5SGSMD4E3H29C2WN delivers a balance of very large programmable logic capacity, significant on‑chip memory, and a high I/O count in a compact BGA package—well suited for commercial designs that require dense digital integration and extensive interfacing. As a Stratix V GS family device, it aligns with the family's electrical and switching documentation for I/O timing and transceiver considerations.

Choose this device when your design demands scalable logic resources, substantial embedded memory, and high pin‑count connectivity in a commercially rated FPGA. Its package and electrical specifications make it appropriate for systems where board density and integration are priorities.

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